초록 ▼

A printed wiring board for carrying a semiconductor chip including a resin base substrate having at least one opening therethrough, a thermo-conductive plate for mounting the semiconductor chip thereon, the plate being inserted into the opening, an insulating adhesive layer covering at least one sid

A printed wiring board for carrying a semiconductor chip including a resin base substrate having at least one opening therethrough, a thermo-conductive plate for mounting the semiconductor chip thereon, the plate being inserted into the opening, an insulating adhesive layer covering at least one side of the substrate and an electric circuit formed on the layer. The wiring board of this invention eliminates those disadvantages of the existing resin substrate type and metal core type. In essence, the wiring board of this invention displays excellent heat releasing capability and magnetic shield effect as well as reliable electric insulation.

대표청구항 ▼

A semiconductor chip carrier comprising: an insulative substrate having at least one opening extending through the thickness thereof; a thermo-conductive plate in contact with the circumference of the opening inserted in the opening for supporting a semiconductor chip thereon; and an upper insulativ

A semiconductor chip carrier comprising: an insulative substrate having at least one opening extending through the thickness thereof; a thermo-conductive plate in contact with the circumference of the opening inserted in the opening for supporting a semiconductor chip thereon; and an upper insulative adhesive layer and a lower insulative adhesive layer for electrical connection with the semiconductor chip; and wherein said conductive layer is provided with a hole extending through the thickness of the upper insulative adhesive layer in which the thermo-conductive plate is exposed, the lower insulative layer is provided with a hole in which the thermo-conductive plate is exposed and said holes of the insulative adhesive layers are dimensioned to be smaller than the opening of the insulative substrate so as to define along the inner circumference thereof internal flanges which are placed over the marginal portions of the thermo-conductive plate in direct contact relation therewith.