초록 ▼

A process for treating workpieces in a normally closed treatment chamber. The process comprises providing a pressure within the chamber which is less than atmospheric and providing an unsaturated treatment vapor within the chamber. A workpiece is then moved into the chamber to be treated by the unsa

A process for treating workpieces in a normally closed treatment chamber. The process comprises providing a pressure within the chamber which is less than atmospheric and providing an unsaturated treatment vapor within the chamber. A workpiece is then moved into the chamber to be treated by the unsaturated vapor. The process is particularly suited for the vapor phase soldering of printed circuit boards. The unsaturated vapor in the chamber is heated to a temperature higher than the melting point of the solder used and the circuit boards with solder thereon are passed through the vapor in the chamber to reflow the solder. The invention is also directed toward an apparatus for carrying out the process.

대표청구항 ▼

A process for treating workpieces in a normally closed treatment chamber which comprises: maintainin a pressure within the treatment chamber which is less than atmospheric so as to cause atmosphere to flow into the treatment chamber when it is opened to the atmosphere; generating an unsaturated trea

A process for treating workpieces in a normally closed treatment chamber which comprises: maintainin a pressure within the treatment chamber which is less than atmospheric so as to cause atmosphere to flow into the treatment chamber when it is opened to the atmosphere; generating an unsaturated treatment vapour within the treatment chamber by vapourizing a liquid within the treatment chamber; heating the unsaturated treatment vapour within the treatment chamber to a desired temperature above the boiling point of the liquid; and moving a workpiece into the chamber and through the heated, unsaturated vapour in the chamber to be treated by the vapour.