초록 ▼

A semiconductor package of the small outlined integrated circuit type is disclosed having an angled glass sealing surface. Another aspect of the invention relates to a shield disposed in a semiconductor package to prevent alpha radiation emitted from the sealing glass or other packaging components f

A semiconductor package of the small outlined integrated circuit type is disclosed having an angled glass sealing surface. Another aspect of the invention relates to a shield disposed in a semiconductor package to prevent alpha radiation emitted from the sealing glass or other packaging components from impinging on the housed semiconductor device.

대표청구항 ▼

A semiconductor package for housing a semiconductor device, comprising: a base component having spaced parallel internal and external surfaces and a base sealing surface connected to said internal and external surfaces at the outer periphery thereof and at least a portion of said base sealing surfac

A semiconductor package for housing a semiconductor device, comprising: a base component having spaced parallel internal and external surfaces and a base sealing surface connected to said internal and external surfaces at the outer periphery thereof and at least a portion of said base sealing surface being formed at an angle of from about 20°to about 80°with the respect to said external surface; a lid component stacked on said base component to form a cavity adapted to house a semiconductor device, said lid component having spaced parallel internal and external surfaces and a lid sealing surface connected to said internal and external surfaces at the outer periphery thereof and at least a portion of said lid sealing surface being formed at an angle of from about 20°to about 80°with respect to said external surface, said angle selected to be substantially parallel to said base sealing surface when said lid component is stacked on said base component; a leadframe disposed between the base sealing surface and the lid sealing surface; and sealing means disposed between and bonded to the base sealing surface and the lid sealing surface for sealing said semiconductor package.