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[미국특허] Plug-in card module 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-023/72
출원번호 US-0211589 (1988-06-27)
발명자 / 주소
  • Mann
  • Jr. James A. (Richardson TX) Haselton E. Fletcher (Irving TX)
출원인 / 주소
  • Teknekron Infoswitch Corporation (Fort Worth TX 02)
인용정보 피인용 횟수 : 55  인용 특허 : 10

초록 ▼

A novel plug-in card module for use in a rack module having means for supporting a plurality of such modules in an abutting side-by-side relation. The plug-in module comprises a printed circuit board having at least two pairs of card receiving and guiding rails transversely disposed thereon. Each of

대표청구항 ▼

A plug in card module for use in a rack module having means for supporting a plurality of plug in card modules in an abutting side by side relation, comprising: a printed circuit board having first and second sides, a leading edge and a rear edge; at least two pairs of card receiving and guiding rai

이 특허에 인용된 특허 (10) 인용/피인용 타임라인 분석

  1. Watkins Tommy R. (Plano TX), Apparatus for mounting printed circuit boards.
    상세보기
  2. McSparran Joseph F. (Cherry Hill NJ), Circuit board guide and ground connector.
    상세보기
  3. Bauer Willi (Kraichtal DEX) Kessler Otto (Woerth DEX) Schmitt Reinhard (Hagenbach DEX) Wojtas Gerhard (Karlsruhe DEX), Ejection and grounding system for rack-mounted plug-in modules.
    상세보기
  4. Miller William J. (Fullerton CA) Alaniz Steve A. (Monterey Park CA), Ejector for printed circuit board plug-in unit.
    상세보기
  5. Velsher Benne (Ottawa CAX) Hvezda Jaroslav M. (Nepean CAX) Middlehurst Richard J. (Kanata CAX), High density low profile multiple contact connector.
    상세보기
  6. Chu Pak-Jong (Ottawa CAX), Latching lever for printed circuit boards.
    상세보기
  7. Beun Roger A. (Dunrobin CAX), Mounting for line cards on circuit boards in telecommunications apparatus.
    상세보기
  8. Jordan Thomas W. (Berkeley IL), Printed circuit board faceplate assembly.
    상세보기
  9. Milc Thomas A. (Curran CAX), Printed circuit board lock.
    상세보기
  10. Leger Laurie J. (Bradford MA), Universal snap-in card guide for printed circuit card enclosures.
    상세보기

이 특허를 인용한 특허 (55) 인용/피인용 타임라인 분석

  1. Middleton, Anthony P.; Chiasson, Shane; Holt, George Thomas, Alignment and support apparatus for component and card coupling.
    상세보기
  2. Kartheininger, Michael, Assembly for a computer system and angle plug.
    상세보기
  3. Motohashi, Nobumasa; Shimotsu, Akihiro, Card holding member with sealing feature and card connector set.
    상세보기
  4. Liken Peter A. (West Olive MI) Ensing Steven B. (Holland MI), Carrier for use in testing circuit boards.
    상세보기
  5. Wyckoff, Jan M.; Ellis, Vickie L.; Camacho, Manuel, Chassis for modular electronics assembly.
    상세보기
  6. Gierut Lawrence, Circuit board assembly.
    상세보기
  7. Lai, Chia Ching, Circuit board assembly having a compact structure.
    상세보기
  8. Ravid Gonen (29034 Acanthus Ct. Agoura Hills CA 91301), Circuit board guide and interfitting device to eliminate floating cables.
    상세보기
  9. Bang, Hyojae; Kim, Dogeun; Kim, Hongkyun; Jeon, Youngbok, Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same.
    상세보기
  10. Bang, Hyojae; Kim, Dogeun; Kim, Hongkyun; Jeon, Youngbok, Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same.
    상세보기
  11. Korsunsky, Iosif R.; Harlan, Tod M.; Gillespie, Brian J., Electrical connector for interconnecting two intersected printed circuit boards.
    상세보기
  12. Wood Samuel F. (Los Altos Hills CA) Wakerly John F. (Mountain View CA), Expandable data processing chassis and method of assembly thereof.
    상세보기
  13. Fujii, Kazuo; Ishihara, Yoshihisa; Stewart, Aaron M., Expansion board apparatus.
    상세보기
  14. Fujii, Kazuo; Ishihara, Yoshihisa; Stewart, Aaron M., Expansion board apparatus and removing method.
    상세보기
  15. Moss David L., Expansion card carrier and method for a computer system.
    상세보기
  16. Hamlet Darrel J. ; Franklin Eric G., Face plate for a chassis for high frequency components.
    상세보기
  17. McMillian Lonnie S. ; Schofield Wade S. ; Smith Barry S., Form factor-configured channel bank card containing form factor non-conformal printed circuit board.
    상세보기
  18. Lee, Chih-Hsiang; Lien, Yao-Chien; Wu, Hsien-Chih; Chou, Chien Hung; Lin, Kuo-Chih; Hardis, Martin, Full height I/O bracket for low profile expansion card.
    상세보기
  19. Lee, Chih-Hsiang; Lien, Yao-Chien; Wu, Hsien-Chih; Chou, Chien Hung; Lin, Kuo-Chih; Hardis, Martin, Full height I/O bracket for low profile expansion card.
    상세보기
  20. Jaskela, Wayde C., Guides and tab arrangement to retain a card having an edge connector and method of use.
    상세보기
  21. Budnaitis John J., High planarity and low thermal coefficient of expansion base for semi-conductor reliability screening.
    상세보기
  22. Charles H. Reynolds, Housing for remotely switchable power supply for network device racks having network socket openings and power outlet openings on different surfaces.
    상세보기
  23. Charles H. Reynolds, Housing for remotely switchable power supply for network device racks having ports and outlets on one surface.
    상세보기
  24. Brooks, Michael A.; Simon, Glenn C.; Cerniglia, Sean A., Keyed filler panel with removably-coupleable airflow resistive filler card assembly.
    상세보기
  25. Allen Joseph R., Leveraged apparatus for selectively decoupling either of two perpendicularly coupled circuit boards from the other circuit board.
    상세보기
  26. Bang, Hyo-jae; Kim, Do-geun; Kim, Hong-kyun; Jeon, Young-bok, Memory device.
    상세보기
  27. Bang, Hyo-jae; Kim, Do-geun; Kim, Hong-kyun; Jeon, Young-bok, Memory device.
    상세보기
  28. Bang, Hyo-jae; Kim, Do-geun; Kim, Hong-kyun; Jeon, Young-bok, Memory device.
    상세보기
  29. Bang, Hyo-jae; Kim, Do-geun; Kim, Hong-kyun; Jeon, Young-bok, Memory device.
    상세보기
  30. Bang, Hyo-jae; Kim, Do-geun; Kim, Hong-kyun; Jeon, Young-bok, Memory device.
    상세보기
  31. Bang, Hyo-jae; Kim, Do-geun; Kim, Hong-kyun; Jeon, Young-bok, Memory device.
    상세보기
  32. Bang, Hyo-jae; Kim, Do-geun; Kim, Hong-kyun; Jeon, Young-bok, Memory device.
    상세보기
  33. Davis, Simon John; King, Denis Junior; Pike, Dion; Chow, Joey M. W.; Megarity, Mark R., Method for fixed and replaceable module architecture.
    상세보기
  34. Budnaitis John J., Method for performing reliability screening and burn-in of semi-conductor wafers.
    상세보기
  35. Budnaitis John J. ; Leong Jimmy, Method of forming a wafer level contact sheet having a permanent z-axis material.
    상세보기
  36. Budnaitis John J., Method of making a high planarity, low CTE base for semiconductor reliability screening.
    상세보기
  37. Budnaitis John J. ; Leong Jimmy, Method of wafer level burn-in.
    상세보기
  38. Reynolds, Charles H., Methods and apparatus for improved remotely switchable power supply.
    상세보기
  39. Knoop Franz-Josef,DEX, Mounting panel for assemblies.
    상세보기
  40. Barsun,Stephan Karl; Dobbs,Robert William, Multistage mounting printed circuit board system and method.
    상세보기
  41. Charles H. Reynolds, Network remotely switchable power supply.
    상세보기
  42. Satoh Tatsuo,JPX, On-line module replacement system.
    상세보기
  43. Paul Zdinak ; Lawrence M. Kuba ; Derek Riemer, Optical communications device housing portion.
    상세보기
  44. Silva David J. ; Dorfmeyer Mitchell G., Printed circuit board having a dual pattern footprint for receiving one of two component packages.
    상세보기
  45. Dorfmeyer Mitchell G., Printed circuit board having a dual square pattern footprints for receiving one of two electronic components having equ.
    상세보기
  46. Reynolds Charles H., Remotely switchable power supply for network device racks having eight network socket openings and four power outlet openings.
    상세보기
  47. Reynolds Charles H., Remotely switchable power supply for network device racks having eight power outlet openings and sixteen network port openings.
    상세보기
  48. Bang, Hyojae; Kim, Dogeun; Kim, Hongkyun; Jeon, Youngbok, SSD including a case, securing element, circuit board, and at least one package, and methods of forming the SSD.
    상세보기
  49. Campini,Edoardo; Stahl,Douglas Lee; DeNies,Steven; Gilbert,Jay; Budny,Jacek; Wisniewski,Gerard, Stacked multiple connection module.
    상세보기
  50. Wade H. White ; Michael J. Fisher, System and method for a self aligning multiple card enclosure with hot plug capability.
    상세보기
  51. Moulton Harland Timothy ; Goldman Stephen H., System and method for co-planar and nearly co-planar printed circuit board extension docking system.
    상세보기
  52. Campini,Edoardo; Handley,William; Summers,Mark D., Two-dimensional adjustable edge connector adaptor.
    상세보기
  53. Budnaitis John J., Wafer level burn-in base unit substrate and assembly.
    상세보기
  54. Budnaitis John J. ; Leong Jimmy, Wafer level burn-in system.
    상세보기
  55. Budnaitis John J., Wafer level contact sheet and method of assembly.
    상세보기

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