초록 ▼

A system of establishing a conductive via path between spaced interlevel conductors. Successive layers of metallization separated by a dielectric are built. The vias are opened in one step to eliminate interlevel mashing. The system employs annular pads at locations where contact may be established

A system of establishing a conductive via path between spaced interlevel conductors. Successive layers of metallization separated by a dielectric are built. The vias are opened in one step to eliminate interlevel mashing. The system employs annular pads at locations where contact may be established to another wiring level. The vias are self-aligned and taper from top metal to first level contact. The system is applicable both chip-wise and carrier-wise.

대표청구항 ▼

A method of establishing a conductive via path between spaced interlevel conductors comprising the steps of: defining a first level having a pattern of a conductive material and applying a first dielectric layer over said first level of conductive material: applying a second level having a pattern o

A method of establishing a conductive via path between spaced interlevel conductors comprising the steps of: defining a first level having a pattern of a conductive material and applying a first dielectric layer over said first level of conductive material: applying a second level having a pattern of a conductive material with via openings over said first dielectric layer; applying a second dielectric layer over said second level of conductive material; creating a via path by opening said dielectric layers through said via openings in said conductive level and terminating said opening at the first conductive level; and filling said opening with a conductive material.