초록 ▼

A multilayer identification card containing an IC module in a cavity. The cavity is filled with a polymer with a consistency ranging form liquid to pasty before the card compound is laminated using pressure and heat. During lamination, the polymer completely fills in the cavity around the IC module,

A multilayer identification card containing an IC module in a cavity. The cavity is filled with a polymer with a consistency ranging form liquid to pasty before the card compound is laminated using pressure and heat. During lamination, the polymer completely fills in the cavity around the IC module, supported by the applied pressure. In the finished card, the polymer is cross-linked to form a solid, rubber-like mass, which protects the IC module in the cavity of the card.

대표청구항 ▼

A multi-layer identification card comprising: (a) at least one layer having a cavity; (b) an IC module mounted on a carrier disposed in said cavity so that space exists in said cavity between said IC module and said at least one card layer; (c) a hollow area in a layer of said card in communication

A multi-layer identification card comprising: (a) at least one layer having a cavity; (b) an IC module mounted on a carrier disposed in said cavity so that space exists in said cavity between said IC module and said at least one card layer; (c) a hollow area in a layer of said card in communication with said cavity; (d) a channel in a layer of said card having one end opening into said cavity and another end opening into said hollow area to allow for said communication; (e) elastic material filling said space, wherein said channel and said hollow area are adapted to be at least partially filled with elastic material in excess of an amount of elastic material required to fill said space.