초록 ▼

An apparatus and method achieves the submersiontype processing of silicon wafers in a manufacturing process for the fabrication of semiconductor devices therefrom. The silicon wafer is uniformly flooded with the process fluid in a manner which prevents impingement thereof during chemical processing,

An apparatus and method achieves the submersiontype processing of silicon wafers in a manufacturing process for the fabrication of semiconductor devices therefrom. The silicon wafer is uniformly flooded with the process fluid in a manner which prevents impingement thereof during chemical processing, such as wet etching, cleaning, photoresist developing and the like. Upon flooding the silicon wafer, a gas pocket is formed between a portion of the lower surface of the wafer and an adjacent portion of vacuum chuck to which the wafer is mounted. The resulting gas pocket prevents accumulation of processed fluid therein to facilitate spin drying of the wafer.

대표청구항 ▼

An apparatus for the fluid treatment of a workpiece, said apparatus comprising mounting means for mounting a workpiece thereto, fluid supplying means for supplying a fluid for treating the surface of said workpiece, and forming means for forming a gas pocket between a portion of said mounting means

An apparatus for the fluid treatment of a workpiece, said apparatus comprising mounting means for mounting a workpiece thereto, fluid supplying means for supplying a fluid for treating the surface of said workpiece, and forming means for forming a gas pocket between a portion of said mounting means and a portion of said workpiece upon supplying said fluid to said workpiece from said fluid supplying means, whereby said gas pocket prevents contact of said fluid with said portion of said mounting means and said portion of said workpiece.