초록 ▼

An inductance element comprises conductive paths of copper and a spool member arranged on a substrate, and insulated winding formed by a fine copper wire whose surface is coated with an insulating film of urethane etc. is wound around the spool member so that both end portions thereof are subjected

An inductance element comprises conductive paths of copper and a spool member arranged on a substrate, and insulated winding formed by a fine copper wire whose surface is coated with an insulating film of urethane etc. is wound around the spool member so that both end portions thereof are subjected to ultrasonic vibration by an ultrasonic bonding apparatus to be connected to the conductive paths by ultrasonic bonding. Thus, the end portions of the winding can be processed by local heating with application of ultrasonic vibration, whereby the coil needs not be entirely heated and an inductance element can be readily implemented directly on the substrate.

대표청구항 ▼

A method of manufacturing an inductance element, which comprises: a first step of preparing a substrate provided with two conductive paths; a second step of mounting insulated wire of conductive material coated with an insulating layer on a reel of an ultrasonic bonding apparatus; a third step of fe

A method of manufacturing an inductance element, which comprises: a first step of preparing a substrate provided with two conductive paths; a second step of mounting insulated wire of conductive material coated with an insulating layer on a reel of an ultrasonic bonding apparatus; a third step of feeding said insulated wire from said reel of said ultrasonic bonding apparatus and locally heating an end thereof and ultrasonic bonding the same on one of said conductive paths provided on said substrate by applying ultrasonic vibration to said end; a fourth step of feeding said insulated wire to form a coil; and a fifth step of ultrasonically - bonding the other end of said insulated wire on the other of said conductive paths provided on said substrate; wherein said first step includes a step of forming a spool member on said substrate, and said fourth step includes a step of winding said insulated wire around said spool member, and wherein said bonding apparatus includes a capillary chip for holding an end of said insulated wire fed from said reel, said third step includes a step of locating said capillary chip of said bonding apparatus on said one conductive path to bond an end of said insulated wire on said one conductive path, said fourth step includes a step of locating said capillary chip around the periphery of said spool member from said location on said one conductive path and rotating said chip about said periphery of said spool member thereby to wind said insulated wire around said spool member, and said fifth step includes a step of, after winding said insulated wire around said spool member, locating said capillary chip on said other conductive path to bond the other end of said insulated wire on said other conductive path.