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Aerospace structure having a cast-in-place noncompressible void filler 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-003/00
  • B64C-001/06
출원번호 US-0025403 (1987-03-13)
발명자 / 주소
  • Scollard Cynthia M. (Kent WA)
출원인 / 주소
  • The Boeing Company (Seattle WA 02)
인용정보 피인용 횟수 : 22  인용 특허 : 18

초록

An aerospace structure and method for its construction composed of two elements having mutually opposed mating surfaces, at least one of which is irregular. The mating surfaces of the elements are fastened and compressed against a noncompressible cast-in-place void filler having complimentary shape

대표청구항

An aerospace structure having aerodynamic surfaces positioned in a desired orientation comprising: two structural elements, each of the structural elements having an aerodynamic surface and an abutting surface, the aerodynamic surfaces being positioned in the desired orientation thereby positioning

이 특허에 인용된 특허 (18)

  1. Bannink, Jr., Engbert T., Conductive bonded/bolted joint seals for composite aircraft.
  2. Ehrreich John E. (Acton MA), Conductive compositions and conductive powders for use therein.
  3. Bannink, Jr., Engbert T., Conductive joint seals for composite aircraft.
  4. Abrams John C. (Tappan NY), Conductive paste, electroconductive body and fabrication of same.
  5. Mastrangelo Sebastian Vito Rocco (Hockessin DE), Electrically conductive adhesive composition.
  6. Powers ; Jr. Donald H. (Needham MA), Electromagnetic shielding.
  7. Ivanov Albert Bonevich (ULITSA Miklukho-Maklaya ; 43 ; kv. 17 Moscow SU) Krasulin Jury Leonidovich (ULITSA Angarskaya ; 65 ; kv. 123 Moscow SU) Gordienko Lev Kimovich (Kutuzovsky prospekt ; 18 ; kv. , Heat-resistant porous structural material.
  8. Torobin Leonard B. (Materials Technology Corp. ; P.O. Box 6844 Bellevue WA 93007), Hollow microspheres.
  9. Ota Hiroshi (Tokyo JPX) Sakuma Noboru (Kamakura JPX) Takarabe Takeki (Tokyo JPX) Takiguchi Isao (Tokyo JPX), Lightweight materials having a high dielectric constant and their method of manufacture.
  10. Kourtides Demetrius A. (San Jose CA) Parker John A. (Los Altos CA), Low density bismaleimide-carbon microballoon composites.
  11. Knappenberger Thomas A. (Phoenix AZ) Landers ; Jr. James F. (Tempe AZ), Method for potting and encapsulating electronic circuits.
  12. Stechler Bernard G. (766 Brady Ave. Bronx NY 10462), Method of forming electrical insulation by extruding polymeric compositions containing hollow microspheres.
  13. Bannink, Jr., Engbert T., Method of sealing and bonding laminated epoxy plates.
  14. Wells James N. (Cottage Grove MN), Poly(urethane-isocyanurate) foams containing hollow glass spheres.
  15. Long William Gordon (Lynchburg VA), Sandwich panel construction.
  16. Kaufmann Meinolph (Fislisbach CHX), Sealing cement useful for producing liquid crystal display cells.
  17. Hing Peter (London GB2), Sealing of ceramic and cermet parts, sealing material therefor and ceramic seal obtained.
  18. Liu Nan-I (Mt. Vernon IN) van der Meer Roelof (Bergen op Zoom NLX), Synergistic effect of metal flake and metal or metal coated fiber on EMI shielding effectiveness of thermoplastics.

이 특허를 인용한 특허 (22)

  1. Munsen, Victor A.; Berry, David Neal, Aircraft, airframes and associated methods.
  2. Bunyan Michael H. ; Kalinoski John P. ; Lucia Russell T. ; Vilandre Paul R. ; Watchko George R. ; Shvartsman Rudolf I. ; Soron John E., Apparatus for forming a gasket.
  3. Stevenson, James F.; Vacanti, David C.; Sund, Steve Erik; Lui, Siu-ching D., Composite avionics chassis.
  4. Zimmerman Kristin B. (St. Clair Shores MI) Liu Dahsin (Okemos MI), Composite joining and repair.
  5. Kalinoski John P., Corrosion-resistant, form-in-place EMI shielding gasket.
  6. Daws David Eric, Dowel adhesive method for repair of ceramic matrix composites.
  7. Marche, Jacques Hervé, Engine assembly for aircraft including a modular rigid structure for mounting pylons.
  8. Elgimiabi, Sohaib; Lamon, Alain H., Fire-retardant low-density epoxy composition.
  9. Bunyan, Michael H.; Kalinoski, John P., Form-in place EMI gaskets.
  10. Bunyan Michael H. ; Kalinoski John P., Form-in-place EMI gaskets.
  11. Kalinoski John P. ; Bunyan Michael H., Form-in-place EMI gaskets.
  12. Kalinoski John P. ; Bunyan Michael H., Form-in-place EMI gaskets.
  13. Stevenson, James F.; Vacanti, David C.; Lui, Siu-Ching D., Housings for electronic components.
  14. Johnson, Darren, Joint configuration.
  15. Fisher, David; Rutherford, Alan L, Manufacturing and assembly of structures using shims.
  16. Pridie, Jago, Method for joining aircraft components.
  17. Luippold David Arthur ; Brown Mark David ; Tully John Wilbur, Method for reducing reflected radio frequency electromagnetic radiation.
  18. Kebbede, Anteneh; Brun, Milivoj Konstantin; Luthra, Krishan Lal; McGuigan, Henry Charles, Method for repairing articles of ceramic composites.
  19. Jorn, Paul, Method for tolerance compensation between two fibre composite components.
  20. Erban, Christof, Plate-shaped laminated element with position fixing element for a bonded assembly.
  21. Hitoshi Yamada JP; Kazuki Morimoto JP; Katsuya Kusuno JP; Shuichiro Wada JP; Kazuo Nishimoto JP, Resin composition.
  22. Karavakis, Konstantine; Bahl, Kenneth S., Via in a printed circuit board.
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