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Method and apparatus for cleaning integrated circuit wafers 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/306
  • B44C-001/22
  • C03C-015/00
  • C03C-025/06
출원번호 US-0251043 (1988-09-26)
발명자 / 주소
  • Freeman Dean W. (Garland TX) Davis Cecil J. (Greenville TX)
출원인 / 주소
  • Texas Instruments Incorporated (Dallas TX 02)
인용정보 피인용 횟수 : 60  인용 특허 : 6

초록 ▼

The described embodiment of the present invention provides a method and device for cleaning the surface of a silicon wafer using dry gases. At least one of the gases provided is excited by passing the gas through a microwave plasma generator or by heating the wafer thereby exciting the gases near th

대표청구항

A method for treating a semiconductor wafer comprising the steps of: providing said semiconductor wafer; exciting a cleaning gas to a non-plasma state; and flowing said cleaning gas over said wafer.

이 특허에 인용된 특허 (6)

  1. Tsujii Kanji (Nishitama JPX) Yajima Yusuke (Musashino JPX) Murayama Seiichi (Kokubunji JPX), Dry etching apparatus.
    상세보기
  2. Horiike Yasuhiro (Tokyo JPX), Gas-etching device.
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  3. Bersin Richard L. (Orange CT), Method and apparatus for dry processing of substrates.
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  4. Tsujii Kanji (Nishitama JPX) Yajima Yusuke (Musashino JPX) Murayama Seiichi (Kokubunji JPX), Method of dry etching.
    상세보기
  5. Tsuchimoto ; Takashi, Plasma processor.
    상세보기
  6. Sekiguchi Atsushi (Fuchu JPX) Mito Hideo (Fuchu JPX), Surface processing apparatus utilizing local thermal equilibrium plasma and method of using same.
    상세보기

이 특허를 인용한 특허 (60)

  1. Kikuchi Jun,JPX ; Fujimura Shuzo,JPX ; Iga Masao,JPX, Apparatus for fabricating semiconductor device and method for fabricating semiconductor device.
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  2. Kikuchi Jun,JPX ; Fujimura Shuzo,JPX ; Iga Masao,JPX, Apparatus for fabricating semiconductor device and method for fabricating semiconductor device.
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  3. Bran,Mario E., Apparatus for megasonic processing of an article.
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  4. Sun, Zhi-Wen; Jiang, Anbei; Huang, Tuo-Chuan, Cleaning of multicompositional etchant residues.
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  5. Tan,Samantha S. H.; Chen,Ning, Cleaning process and apparatus for silicate materials.
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  6. Tan,Samantha S. H.; Chen,Ning, Cleaning process and apparatus for silicate materials.
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  7. Lau, Wesley George, Cleaning process residues from substrate processing chamber components.
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  8. Tan, Samantha S. H., Cleaning processes for silicon carbide materials.
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  9. Ngo, Minh V.; Lin, Ming-Ren; Besser, Paul R.; Xiang, Qi; Paton, Eric N.; Goo, Jung-Suk, Depletion to avoid cross contamination.
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  10. Laxman Murugesh ; Padmanaban Krishnaraj ; Michael Cox ; Canfeng Lai ; Narendra Dubey ; Tom K. Cho ; Sudhir Ram Gondhalekar ; Lily L. Pang, Directing a flow of gas in a substrate processing chamber.
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  11. Roberson ; Jr. Glenn A. (Hollister CA) Genco Robert M. (Atlanta GA) Mundt G. Kyle (Duluth GA), Docking and environmental purging system for integrated circuit wafer transport assemblies.
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  12. Roberson ; Jr. Glenn A. ; Genco Robert M. ; Mundt G. Kyle, Docking and environmental purging system for integrated circuit wafer transport assemblies.
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  13. Roberson ; Jr. Glenn A. ; Genco Robert M. ; Mundt G. Kyle, Docking and environmental purging system for integrated circuit wafer transport assemblies.
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  14. Yuen, Stephen; Jain, Mohit; Lill, Thorsten B., Etching a substrate in a process zone.
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  15. Barth Stephan-Manuel,DEX, Etching process and device for cleaning semiconductor components, in particular power diodes.
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  16. Kusumoto, Naoto; Takayama, Toru; Yonezawa, Masato, Laser annealing method and laser annealing device.
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  17. Kusumoto,Naoto; Takayama,Toru; Yonezawa,Masato, Laser annealing method and laser annealing device.
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  18. Harada Shigeru,JPX ; Yamashita Takashi,JPX ; Fujiki Noriaki,JPX ; Tanaka Tsutomu,JPX, Method and apparatus for manufacturing a semiconductor integrated circuit.
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  19. Christopher H. Raeder, Method and product for improved use of low k dielectric material among integrated circuit interconnect structures.
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  20. Naoto Kusumoto JP; Toru Takayama JP; Masato Yonezawa JP, Method for manufacturing semiconductor devices.
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  21. Bran, Mario E., Method for megasonic processing of an article.
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  22. Bran,Mario E., Method of cleaning a side of a thin flat substrate by applying sonic energy to the opposite side of the substrate.
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  23. Vassalli Omar,ITX, Method of enhancing the rate of removal of a layer of light-sensitive material after an etching step in the fabrication of semiconductor electronic devices.
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  24. Nakajima,Setsuo; Shiga,Aiko; Makita,Naoki; Matsuo,Takuya, Method of manufacturing a semiconductor device and semiconductor manufacturing apparatus.
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  25. Nakajima,Setsuo; Shiga,Aiko; Makita,Naoki; Matsuo,Takuya, Method of manufacturing a semiconductor device by irradiating with a laser beam.
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  26. Bran, Mario E., Method of manufacturing integrated circuit devices.
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  27. Rabinovich, Felix; Echols, Thomas; Maleski, Janet; Chen, Ning; Tan, Samantha S. H., Methods and apparatus for cleaning chamber components.
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  28. Chebi, Robert; Hemker, David, Methods for reducing contamination of semiconductor substrates.
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  29. Chebi, Robert; Hemker, David, Methods for reducing contamination of semiconductor substrates.
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  30. Glenn A. Roberson, Jr. ; Robert M. Genco ; Robert B. Eglinton ; Wayland Comer ; Gregory K. Mundt, Molecular contamination control system.
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  31. Roberson ; Jr. Glenn A. ; Genco Robert M. ; Eglinton Robert B. ; Comer Wayland ; Mundt Gregory K., Molecular contamination control system.
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  32. Roberson ; Jr. Glenn A. ; Genco Robert M. ; Eglinton Robert B. ; Comer Wayland ; Mundt Gregory K., Molecular contamination control system.
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  33. Roberson ; Jr. Glenn A. ; Genco Robert M. ; Eglinton Robert B. ; Comer Wayland ; Mundt Gregory K., Molecular contamination control system.
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  34. Chow, Waiching; Williams, Raney; Lill, Thorsten B.; Chen, Arthur Y., Multiple stage process for cleaning process chambers.
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  35. Kojima Hiroshi,JPX ; Tahara Yoshifumi,JPX ; Arai Izumi,JPX, Plasma processing method.
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  36. Shive Larry W. ; Pirooz Saeed, Pre-thermal treatment cleaning process.
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  37. Kholodenko, Arnold V.; Katz, Dan; Cheng, Wing L., Process chamber having multiple gas distributors and method.
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  38. Nallan Padmapani ; Chinn Jeffrey ; Yuen Stephen, Process for etching silicon-containing material on substrates.
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  39. Kobayashi, Yasuo; Yoshioka, Masao, Processing apparatus and processing method.
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  40. Kobayashi, Yasuo; Miyatani, Kotaro; Maekawa, Kaoru, Processing method and apparatus for removing oxide film.
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  41. Kobayashi, Yasuo; Miyatani, Kotaro; Maekawa, Kaoru, Processing method and apparatus for removing oxide film.
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  42. Ramachandran Ravikumar ; Natzle Wesley ; Gutsche Martin ; Akatsu Hiroyuki ; Yu Chien, Removal of post-RIE polymer on Al/Cu metal line.
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  43. Qian Xue-Yu ; Sun Zhi-Wen ; Jiang Weinan ; Chen Arthur Y. ; Yin Gerald Zheyao ; Yang Ming-Hsun,TWX ; Kuo Ming-Hsun,TWX ; Mui David S. L. ; Chinn Jeffrey ; Pan Shaoher X. ; Wang Xikun, Self-cleaning etch process.
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  44. Qian, Xue-Yu; Sun, Zhi-Wen; Jiang, Weinan; Chen, Arthur Y.; Yin, Gerald Zheyao; Yang, Ming-Hsun; Kuo, Ming-Hsun; Mui, David S. L.; Chinn, Jeffrey; Pan, Shaoher X.; Wang, Xikun, Self-cleaning etch process.
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  45. Shen, Meihua; Jiang, Wei-nan; Yauw, Oranna; Chinn, Jeffrey, Self-cleaning process for etching silicon-containing material.
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  46. Chen, Haojiang; Papanu, James S.; Kawaguchi, Mark; Herchen, Harald; Hwang, Jeng H.; Jin, Guangxiang; Palagashvili, David, Substrate cleaning apparatus and method.
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  47. Thomas J. Kropewnicki ; Jeremiah T. Pender ; Henry Fong ; Charles Peter Auglis ; Raymond Hung ; Hongqing Shan, Substrate cleaning process.
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  48. Bran, Mario E., System for megasonic processing of an article.
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  49. Bran,Mario E., Transducer assembly for megasonic processing of an article and apparatus utilizing the same.
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  50. Gerald Zheyao Yin ; Xue-Yu Qian ; Patrick L. Leahey ; Jonathan D. Mohn ; Waiching Chow ; Arthur Y. Chen ; Zhi-Wen Sun ; Brian K. Hatcher, Treatment of etching chambers using activated cleaning gas.
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  51. Wang, Xikun; Williams, Scott; Pan, Shaoher X., Two-stage etching process.
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  52. Wang, Xikun; Williams, Scott; Pan, Shaoher X., Two-stage self-cleaning silicon etch process.
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  53. Tan,Samantha; Chen,Ning, Ultrasonic assisted etch using corrosive liquids.
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  54. Tan,Samantha; Chen,Ning, Ultrasonic assisted etch using corrosive liquids.
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  55. Bran, Mario E., Wafer cleaning.
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  56. Bran, Mario E., Wafer cleaning.
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  57. Bran Mario E., Wafer cleaning method.
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  58. Mario E. Bran, Wafer cleaning method.
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  59. Bran Mario E., Wafer cleaning system.
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  60. Bran Mario E., Wafer cleaning system.
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