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The invention features a method of fabricating a printed circuit board with low dielectric materials using a modular technique. Sub-assemblies are first constructed, tested, and then subsequently incorporated into the final circuit board assembly which has a triplate geometry. Dielectric materials a

The invention features a method of fabricating a printed circuit board with low dielectric materials using a modular technique. Sub-assemblies are first constructed, tested, and then subsequently incorporated into the final circuit board assembly which has a triplate geometry. Dielectric materials are chosen which enhance the performance of the circuit board.

대표청구항 ▼

A high performance printed circuit board assembly comprising at least two circuitized power plane sub-assemblies adjacently laminated to each other wherein each of said sub-assemblies is characterized by signal planes disposed about two internal power planes facing each other, each of said sub-assem

A high performance printed circuit board assembly comprising at least two circuitized power plane sub-assemblies adjacently laminated to each other wherein each of said sub-assemblies is characterized by signal planes disposed about two internal power planes facing each other, each of said sub-assemblies having a dielectric between said signal and power planes having a dielectric constant of approximately less than 3.0 and vias disposed within each sub-assembly for providing electrical communication between said signal planes. A method of constructing a high performance printed circuit board assembly utilizing a modular construction technique comprising the steps of: (a) fabricating a number of circuitized power plane sub-assemblies, each respective sub-assembly characterized by a signal plane disposed on opposite sides of two internal power planes facing each other, each of said sub-assemblies having a dielectric between said signal and power planes, and electrically communicating by means of plated vias where necessary; and (b) laminating at least two sub-assemblies together to form a composite; and (c) constructing a printed circuit board assembly by building a multi-laminate structure using said composite.