초록 ▼

Wire for repairing or changing circuit elements such as printed circuits has heat-resistant insulation surrounded by a hot-melt adhesive. The wire is attached to the surfaces of printed circuit boards easily by applying a hot iron to the adhesive layer on the wire and melting the adhesive which then

Wire for repairing or changing circuit elements such as printed circuits has heat-resistant insulation surrounded by a hot-melt adhesive. The wire is attached to the surfaces of printed circuit boards easily by applying a hot iron to the adhesive layer on the wire and melting the adhesive which then adheres to the board surface. The hot iron has a tip with a groove in it so that when the iron tip is pressed onto the wire, the tip embraces the wire to melt the adhesive quickly and to make the bond relatively quickly. The coating is applied by passing insulated wire vertically through a length of molten adhesive and then through a die. A cleaner/holder device is used for cleaning the tip of a hot iron used for melting adhesive, or a soldering iron, and for holding the hot iron when it is not in use. The preferred cleaner is anti-combustion treated absorbent cotton string wound on a spool which is mounted in the holder, or adhesive tape with a soft clutch backing. A fresh cleaning surface can be provided simply by rotating the spool, or unwinding a layer of the cleaning material and removing it.

대표청구항 ▼

A method of modifying a completed electrical circuit on an electrical circuit member, said method comprising the steps of providing a wire comprising a length of conductor having an electrical insulation layer and an adhesive layer surrounding the insulation layer, electrically connecting the ends o

A method of modifying a completed electrical circuit on an electrical circuit member, said method comprising the steps of providing a wire comprising a length of conductor having an electrical insulation layer and an adhesive layer surrounding the insulation layer, electrically connecting the ends of the conductor to said circuit member, said adhesive being normally inactive and being activated by the application of heat thereto, and pressing a tip of a heat applicator against said wire to hold said wire against said board while heating said adhesive by contact with said tip to fasten said wire to said circuit member.