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Apparatus and method for cooling an electronic device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0229051 (1988-08-05)
발명자 / 주소
  • Porter Warren W. (Escondido CA)
출원인 / 주소
  • NCR Corporation (Dayton OH 02)
인용정보 피인용 횟수 : 48  인용 특허 : 7

초록 ▼

The subject invention is an apparatus and method for cooling an electronic device. The apparatus comprises a vessel having upper and lower regions and inlet means for delivering a flow of cooling fluid to the upper region. The apparatus also includes means for positioning the device within the lower

대표청구항 ▼

An apparatus for cooling an electronic device comprising: a vessel having upper and lower regions; inlet means for delivering a flow of cooling fluid to said upper region; means for positioning said device within said lower region and above the bottom of said vessel; divider means within said vessel

이 특허에 인용된 특허 (7)

  1. Mittal Faquir C. (Audubon PA), Apparatus for cooling integrated circuit chips.
    상세보기
  2. Vogel Xaver (Turgi CHX), Cooling body for the liquid cooling of high-power semiconductor components.
    상세보기
  3. Kobayashi Gai (Amagasaki JA) Shikano Yoshiro (Amagasaki JA), Cooling device for electric device.
    상세보기
  4. Eastman, Dean E.; Eldridge, Jerome M.; Petersen, Kurt E.; Olive, Graham, Cooling system for VLSI circuit chips.
    상세보기
  5. Porter Warren W. (Escondido CA), Cryogenic fluid transfer conduit.
    상세보기
  6. Waldon Paul L. (Hickory NC) Bennett Ronald E. (Hickory NC), Electrical apparatus with heat pipe cooling.
    상세보기
  7. Mitsuoka Hiroshi (Amagasaki JA), Heat transferring apparatus.
    상세보기

이 특허를 인용한 특허 (48)

  1. Brewer,Richard Grant; Upadhya,Girish; Zhou,Peng; McMaster,Mark; Tsao,Paul, Apparatus and method of efficient fluid delivery for cooling a heat producing device.
    상세보기
  2. Kenny,Thomas; McMaster,Mark; Lovette,James, Apparatus and method of forming channels in a heat-exchanging device.
    상세보기
  3. Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Apparatus for conditioning power and managing thermal energy in an electronic device.
    상세보기
  4. Datta, Madhav; McMaster, Mark, Bonded metal and ceramic plates for thermal management of optical and electronic devices.
    상세보기
  5. Cosley,Michael R.; Fischer,Richard L., Cooling system for densely packed electronic components.
    상세보기
  6. Kenny, Thomas W.; Munch, Mark; Zhou, Peng; Shook, James Gill; Goodson, Kenneth; Corbin, Dave; McMaster, Mark; Lovette, James, Cooling systems incorporating heat exchangers and thermoelectric layers.
    상세보기
  7. Shook,James Gill; Lovette,James, Decoupled spring-loaded mounting apparatus and method of manufacturing thereof.
    상세보기
  8. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
    상세보기
  9. Correa, Adrian; Lin, Tien-Chieh (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
    상세보기
  10. Galian Francois (Pontault-Combault FRX) Feuillioux Andr (Montlucon FRX), Devices for regulating the temperature of an element by blowing a gas at appropriate temperature.
    상세보기
  11. Burward-Hoy Trevor, Electronic package cooling system and heat sink with heat transfer assembly.
    상세보기
  12. Przilas Mark B. ; Mimlitch ; III Robert H. ; Bruce Robert A., Environmentally isolated enclosure for electronic components.
    상세보기
  13. Munch, Mark; Werner, Douglas E., Gimballed attachment for multiple heat exchangers.
    상세보기
  14. Burward-Hoy Trevor, Heat exchanger for electronic equipment.
    상세보기
  15. Werner,Douglas; Munch,Mark; Kenny,Thomas, Hermetic closed loop fluid system.
    상세보기
  16. Przilas Mark B. ; Mimlitch ; III Robert H. ; Bruce Robert A., Hermetic connector for a closed compartment.
    상세보기
  17. Shedd, Timothy A., High efficiency thermal management system.
    상세보기
  18. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
    상세보기
  19. Hom, James; Choi, Hae-won; Lin, Tien Chih (Eric); Werner, Douglas E.; Chow, Norman; Correa, Adrian; Leong, Brandon; Gopalakrishnan, Sudhakar; Brewer, Richard Grant; McMaster, Mark; Upadhya, Girish, Internal access mechanism for a server rack.
    상세보기
  20. Upadhya,Girish; Kenny,Thomas W.; Zhou,Peng; Munch,Mark; Shook,James Gill; Goodson,Kenneth; Corbin,David, Interwoven manifolds for pressure drop reduction in microchannel heat exchangers.
    상세보기
  21. Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Upadhya, Girish; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
    상세보기
  22. Upadhya, Girish; Munch, Mark; Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
    상세보기
  23. Goodson,Kenneth; Kenny,Thomas; Zhou,Peng; Upadhya,Girish; Munch,Mark; McMaster,Mark; Horn,James, Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device.
    상세보기
  24. Upadhya,Girish; Brewer,Richard Grant; McMaster,Mark, Method and apparatus for controlling freezing nucleation and propagation.
    상세보기
  25. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James, Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device.
    상세보기
  26. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,David, Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device.
    상세보기
  27. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
    상세보기
  28. Kenny,Thomas W.; Shook,James Gill; Zeng,Shulin; Lenehan,Daniel J.; Santiago,Juan; Lovette,James, Micro-fabricated electrokinetic pump with on-frit electrode.
    상세보기
  29. Datta, Madhav; Leong, Brandon; McMaster, Mark, Microheat exchanger for laser diode cooling.
    상세보기
  30. Lovette,James; Zhou,Peng; Shook,James Gill, Multi-level microchannel heat exchangers.
    상세보기
  31. Upadhya, Girish; Herms, Richard; Zhou, Peng; Goodson, Kenneth; Hom, James, Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange.
    상세보기
  32. Zhou,Peng; van Der Heide,Dolf; Goodson,Kenneth; Upadhya,Girish, Optimized multiple heat pipe blocks for electronics cooling.
    상세보기
  33. Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Power conditioning module.
    상세보기
  34. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
    상세보기
  35. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
    상세보기
  36. Hileman Vince P. ; Harpell Gary A., Refrigeration cooled disk storage assembly.
    상세보기
  37. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
    상세보기
  38. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
    상세보기
  39. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
    상세보기
  40. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
    상세보기
  41. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
    상세보기
  42. Cosley, Michael R.; Fischer, Richard L.; Thiesen, Jack H.; Willen, Gary S., Small scale chip cooler assembly.
    상세보기
  43. Burward-Hoy Trevor (Cupertino CA), Sub-ambient temperature electronic package.
    상세보기
  44. Smith, David Lane, System and method for fluid cooling of electronic devices installed in a sealed enclosure.
    상세보기
  45. Smith, David Lane, System and method for fluid cooling of electronic devices installed in a sealed enclosure.
    상세보기
  46. Smith, David Lane, System and method for fluid cooling of electronic devices installed in a sealed enclosure.
    상세보기
  47. Smith, David Lane, System and method for fluid cooling of electronic devices installed in a sealed enclosure.
    상세보기
  48. Zhou,Peng; Goodson,Kenneth; Suntiago,Juan, Vapor escape microchannel heat exchanger.
    상세보기

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