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Thermally stable dual metal coated laminate products made from textured polyimide film 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-015/04
출원번호 US-0155897 (1988-02-16)
발명자 / 주소
  • Walsh Daniel P. (Peabody MA) Knudsen Philip D. (South Berwick ME)
출원인 / 주소
  • Polyonics Corporation (Newbury Port MA 02)
인용정보 피인용 횟수 : 62  인용 특허 : 4

초록

Both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt l

대표청구항

A polyimide laminate sheet product including as one layer of said laminate sheet product a polyimide sheet having two surfaces, each of said polyimide sheet surfaces having a uniformly and substantially completely frosted or matte appearance and each of said polyimide sheet surfaces being free of an

이 특허에 인용된 특허 (4)

  1. Knudsen Philip D. (South Berwick ME) Walsh Daniel P. (Peabody MA), Metal coated laminate products made from textured polyimide film.
  2. Gass William R. (Pittsburgh PA) Scala Luciano C. (Murrysville PA) Phillips David C. (Penn Hills Township ; Allegheny County PA), Method for coating of polyimide by electrodeposition.
  3. Konicek Jiri K. (Bennington VT), Printed circuit material.
  4. Konicek Jiri K. (Bennington VT), Printed circuit material.

이 특허를 인용한 특허 (62)

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  8. Wang, Xikun; Pandit, Mandar; Cui, Zhenjiang; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K.; Liu, Jie, Chlorine-based hardmask removal.
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  22. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated bit-line airgap formation and gate stack post clean.
  23. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated oxide recess and floating gate fin trimming.
  24. Nguyen, Son T.; Lubomirsky, Dmitry, Layered thin film heater and method of fabrication.
  25. Hsu, Ching-Mei; Ingle, Nitin K.; Hamana, Hiroshi; Wang, Anchuan, Low temperature gas-phase carbon removal.
  26. Ko, Jungmin, Method of fin patterning.
  27. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Methods for etch of metal and metal-oxide films.
  28. Burke Thomas F. ; Hoover Merwin F. ; Bradshaw John H., Multilayer metalized composite on polymer film product and process.
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  30. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K.; Anthis, Jeffrey W.; Schmiege, Benjamin, Oxide and metal removal.
  31. Chen, Zhijun; Wang, Anchuan; Ingle, Nitin K., Oxide etch selectivity enhancement.
  32. Xu, Lin; Chen, Zhijun; Wang, Anchuan; Nguyen, Son T., Oxide etch selectivity systems and methods.
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  43. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective etch of silicon by way of metastable hydrogen termination.
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  54. Kim, Hun Sang; Choi, Jinhan; Koseki, Shinichi, Simplified litho-etch-litho-etch process.
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  56. Benjaminson, David; Lubomirsky, Dmitry, Thermal management systems and methods for wafer processing systems.
  57. Feng, Bao; McGilvray, Andrew; Shi, Bo, Thin film with oriented cracks on a flexible substrate.
  58. Wang, Xikun; Pandit, Mandar; Wang, Anchuan; Ingle, Nitin K., Titanium nitride removal.
  59. Wang, Xikun; Xu, Lin; Wang, Anchuan; Ingle, Nitin K., Titanium oxide etch.
  60. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K., Tungsten separation.
  61. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., V trench dry etch.
  62. Liu, Jie; Purayath, Vinod R.; Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Vertical gate separation.
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