초록 ▼

Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compo

Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.

대표청구항 ▼

An electrolyte for limiting the formation of tetravalent tin oxide sludge when electroplating tin or tin-lead alloys therefrom, which electrolyte comprises a soluble divalent tin compound; a soluble alkyl sulfonic acid in an amount sufficient to provide a solution having a pH less than about 3; at l

An electrolyte for limiting the formation of tetravalent tin oxide sludge when electroplating tin or tin-lead alloys therefrom, which electrolyte comprises a soluble divalent tin compound; a soluble alkyl sulfonic acid in an amount sufficient to provide a solution having a pH less than about 3; at least one wetting agent; and resorcinol in an amount sufficient to reduce or prevent the formation of tetravalent tin and stannic oxide sludge when electroplating.