초록 ▼

A DC to AC power inverter has an improved construction providing for substantially improved thermal disipation, reliability, and efficiency; the inverter has a unitary combination frame and heat diffuser with a pair of opposed U-shaped sections at right angles to each other and with a common base, a

A DC to AC power inverter has an improved construction providing for substantially improved thermal disipation, reliability, and efficiency; the inverter has a unitary combination frame and heat diffuser with a pair of opposed U-shaped sections at right angles to each other and with a common base, a cover, a transformer, a primary internal heat sink inside of and on the frame, a plurality of power switches fastened on the internal heat sink, a printed circuit board fastened to and spaced from the heat sink with leads from the switches connected to the board, the transformer is fastened onto the frame in heat exchange relationship and part of the coil extends through the frame into an air passageway. All of the wiring access is on a field wiring end and the opposite end is a control end with the switches and circuit board; an improved arrangement of components and leads provides discrete separation of the high and low voltage components and leads. The inverter is extremely effective at heat disipation and has been UL tested and approved.

대표청구항 ▼

An electrical DC to AC inverter having improved structure for providing improved thermal disipation, comprising: (a) a thermally conductive and structurally self sufficient frame; (b) a cover on said frame, said cover and frame jointly defining an enclosed electrical component compartment; (c) conve

An electrical DC to AC inverter having improved structure for providing improved thermal disipation, comprising: (a) a thermally conductive and structurally self sufficient frame; (b) a cover on said frame, said cover and frame jointly defining an enclosed electrical component compartment; (c) converting means within said compartment for converting DC to AC; (d) an internal primary heat sink mounted directly upon and in direct thermal exchange relationship with an internal surfaces of the frame; (e) a secondary heat sink mounted directly upon and in direct thermal exchange relationship with an external surface of the frame, said primary and secondary heat sinks being opposite to each other and substantially overlapping each other; (f) said converting means including semi-conductor power switches in the component enclosure, said switches being mounted directly upon and in direct thermal exchange relationship with the primary heat sink; and including (g) a printed circuit board mounted to and spaced from said primary heat sink, said power switches having leads extending to and secured to said PCB.