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NTIS 바로가기국가/구분 | United States(US) Patent 등록 |
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국제특허분류(IPC7판) |
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출원번호 | US-0177896 (1988-04-01) |
우선권정보 | JP-0109308 (1985-05-23); JP-0109309 (1985-05-23) |
발명자 / 주소 |
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출원인 / 주소 |
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인용정보 | 피인용 횟수 : 1 인용 특허 : 6 |
The present invention relates to a method of manufacturing printed circuit boards. The manufacturing method of printed circuit boards under the present invention is to detach a release paper from a metal board on which holes are provided and to which the adhesive sheet and a release paper are attach
A method of manufacturing printed circuit boards which comprises the steps of: preparing a metal board material having holes filled with resin provided therein, attaching an adhesive sheet and a release paper to said metal board material by means of a prepreg, providing lead wire holes at centers of
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