초록

An hermetically sealed, air-less multi-chambered structure for cooling semiconductor chips mounted on a substrate or printed circuit board which employs means for selectively providing a boiling-coolant generation of vapor bubbles for cooling purposes.

대표청구항 ▼

An apparatus for containing and cooling a high-density integrated circuit package comprising in combination: a base, a high-density integrated circuit mounted on said base, a heat exchanger mounted on said base to enclose said circuit and carry away the operational heat thereof by means of a coolant

An apparatus for containing and cooling a high-density integrated circuit package comprising in combination: a base, a high-density integrated circuit mounted on said base, a heat exchanger mounted on said base to enclose said circuit and carry away the operational heat thereof by means of a coolant which is passed through said heat exchanger, said heat exchanger comprising a housing having an especially configured thermally conductive wall for providing an elongated tunnel over said circuit, said tunnel being closed at one end and open at its other end which other end is juxtapositioned to said circuit, a plurality of thermally conductive spheroids arranged in said tunnel and biased into thermally conductive contact with each other, with said circuit and said wall forming said tunnel to maximize heat transfer from said circuit to said wall, and a particle centrally positioned in said spheriods in said tunnel at a point juxtapositioned to said circuit for catalytically enhancing bubble nucleation growth around said circuit.