초록

A method for etching a (110) silicon wafer to produce latching cantilever beams, which bend parallel to the surface of the wafer. The resulting apparatus is also part of the invention.

대표청구항 ▼

An apparatus, comprising: a (110) silicon wafer with a thickness, comprising: a frame; a first cantilever beam, with a first end attached to the frame and a second end, which is a free end which is not attached to the frame, and with a length dimension from the first end to the second end, and a thi

An apparatus, comprising: a (110) silicon wafer with a thickness, comprising: a frame; a first cantilever beam, with a first end attached to the frame and a second end, which is a free end which is not attached to the frame, and with a length dimension from the first end to the second end, and a thickness, wherein the length and the thickness are substantially parallel to the (110) plane, and a width substantially perpendicular to the (110) plane and substantially equal to the thickness of the wafer; a second cantilever beam, with a first end attached to the frame and a second end, which is a free end which is not attached to the frame, and with a length dimension from the first end to the second end, and a thickness, wherein the length and the thickness are substantially parallel to the (110) plane, and a width substantially perpendicular to the (110) plane and substantially equal to the thickness of the wafer, and where the length of the first cantilever forms an angle with the length of the second cantilever, where the value of the angle is substantially 70.5°or 109.5°.