[특허]Circuit board and method of soldering

[미국특허] Circuit board and method of soldering 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-013/04 H05K-003/34
출원번호	US-0230147 (1988-08-09)
발명자 / 주소	Hagner George R. (Cary NC)
출원인 / 주소	Northern Telecom Limited (Montreal CAX 03)
인용정보	피인용 횟수 : 16 인용 특허 : 17

초록 ▼

Circuit boards that permit wave soldering of both leaded and surface mounted components to a common side. The circuit board carries plated grooves to provide interconnections between the components to be mounted to the board. For leaded components on the circuit board, holes are provided extending completely through the board, and the leaded components are mounted and soldered in a conventional fashion. For surface mounted (or leadless) components, small recesses or grooves are provided to accept the terminals of the components themselves. The grooves are plated with an electrically conductive material, and contain a hole that passes from the upper surface to the bottom surface of the circuit board. When the circuit board is wave soldered, in a conventional manner, solder from the wave soldering process engages the holes, passes through the holes to the upper surface of the circuit board, and then runs along the grooves in the upper surface of the circuit board. Upon solidifying, the solder provides an electrical connection between the components.

대표청구항 ▼

A pin grid array adapter (PGAA) comprising: an electrically insulating substrate having first and second approximately parallel surfaces, at least said first surface provided with a plurality of grooves; said grooves terminating at a first end in a pad area comprised of a widened groove, and terminating at a second end in a hole passing between said first and second surfaces; electrically conductive pins in at least some of said holes, said pins protruding from said second surface; an integrated circuit soldered to said first surface, with solder approximately filling said grooves, and solder sealing said holes having said pins. A method of wave soldering a surface mounted component to a circuit board which has conductive grooves on a first surface and holes passing from said grooves to a second surface, said method comprising the steps of: (a) positioning said surface mounted component on said first surface such that terminals of said component mate with respective grooves on said board; (b) passing said circuit board through a wave of solder such that said wave of solder contacts said second surface of said circuit board and such that some solder from said wave engages at least some of said holes, moves through said holes and along at least some of said grooves to said terminals of said component; and (c) removing said circuit board from said solder and allowing it to cool.

이 특허에 인용된 특허 (17) 인용/피인용 타임라인 분석

Martyniak Gerald J. (Indianapolis IN), Assemblies of electrical components with printed circuit boards, and printed circuit board structures therefor.
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Shimizu Teruo (Katano JPX) Matsuoka Tetsuo (Neyagawa JPX), Circuit board assembly and method of manufacturing the same.
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Hagner George R. (San Jose CA), Circuit board with high density electrical tracers.
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Goforth Melvin L. (7619 Hermosa Amarillo TX 79108) Russell Richard G. (6607 Roxton Amarillo TX 79109), Electronic assembly process and apparatus.
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Ohsawa Mitsuo (Tokyo JPX), Electronic circuit arrangement mounted on printed circuit board.
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Morse Robert S. (La Mesa CA), Electronic package assembly with capillary bridging connection.
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Prokop Jon S. (Richardson TX), High terminal count integrated circuit device package.
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Anthony, Thomas R., Insulating glass body with electrical feedthroughs and method of preparation.
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Schelhorn Robert L. (270 Locust La. Cinnaminson NJ 08077), Method of connecting surface mounted packages to a circuit board and the resulting connector.
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Wiech ; Jr. Raymond E. (4659 Pescadero Ave. San Diego CA 92107), Method of fabricating complex micro-circuit boards and substrates.
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Gurol Ismail M. (Seattle WA), Method of making molded circuit board.
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Ohsawa Mitsuo (Chigasaki JPX) Yamamura Masato (Kamakura JPX) Takahashi Toshio (Tokyo JPX), Printed circuit board.
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Sawairi Hitoshi (Hirakata JPX) Hirose Fuminori (Hirakata JPX) Konishikawa Kaoru (Hirakata JPX), Printed circuit board.
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Takahashi Toshio (Tokyo JPX) Ohsawa Mitsuo (Chigasaki JPX), Printed circuit board.
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Cuddy William A. (Montague NJ) Thir Basil (Grosse Ile MI) Eisenstein Stephen E. (Oak Park MI), Printed circuit board soldering.
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Motsch Hans (Geislingen DEX), Process for mounting components with surface junctions to printed-circuit boards.
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Broyer Alfred P. (Hopatcong NJ), Soldering methods and apparatus.
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이 특허를 인용한 특허 (16) 인용/피인용 타임라인 분석

Greenfield Douglas Wayne (Concord NC) Yorkovich Richard Paul (Mt. Gilead NC), Anti-bridging pads for printed circuit boards and interconnecting substrates.
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Allen, Mark Lee; Bower, Chris; Cotton, Darryl, Apparatus and method for forming printed circuit board using fluid reservoirs and connected fluid channels.
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Sherman John V., Arrangement of pads and through-holes for semiconductor packages.
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Berardinelli Carl Frederick ; Otto Thomas M. ; Reeder Galen J., Conductor pattern for surface mount devices and method therefor.
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Stella, Cristiano Gianluca; Cacciola, Rosalba, Electronic system for wave soldering.
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Hoffmeyer Mark Kenneth ; Sluzewski David A., Method and system for reworkable direct chip attach (DCA) structure with thermal enhancement.
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Sugahara, Hiroto, Method for forming a conductive pattern and a wired board.
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Sugahara, Hiroto, Method for forming pattern and a wired board.
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Sweitzer Brent N. (Nerstrand MN), Method for interconnecting a flip chip to a printed circuit substrate.
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Fjelstad, Joseph C., Method of making a circuit subassembly.
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Caldwell Barry E. ; Rowhuff Raymond S., Polymorphic rectilinear thieving pad.
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Stopperan Jahn J., Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board.
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Haeng-Il Kim KR; Gun-Yong Lee KR; Kwang-Soo Jung KR, Printed circuit board and pad apparatus having a solder deposit.
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Harden, Brian L.; Valley, Leon J.; Cox, Alvin E., Printed circuit board assembly with secondary side rigid electrical pin to mate with compliant contact.
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Matsui, Noriyuki; Sakai, Hidehisa, Semiconductor apparatus, substrate design method, and substrate design apparatus.
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Lin Kon M. ; Groves Quentin D. ; Robinson Albert W., Solder thieving pad for wave soldered through-hole components.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Circuit board and method of soldering 원문보기

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[미국특허] Circuit board and method of soldering 원문보기

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이 특허에 인용된 특허 (17) 인용/피인용 타임라인 분석

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