초록 ▼

A package for heating food in a microwave oven is disclosed. The package includes metal shielding or other metal components which cause a gain in electric field strength which is greater than 3. The present invention also involves low load microwave environments where the electric field strength is

A package for heating food in a microwave oven is disclosed. The package includes metal shielding or other metal components which cause a gain in electric field strength which is greater than 3. The present invention also involves low load microwave environments where the electric field strength is greater than 10 volts per centimeter. A rigid, dimensionally stable dielectric support is provided in close proximity to a conductive sheet, being spaced less than 0.5 inch from the conductive sheet. The dielectric support is composed of material selected to avoid failure of the dielectric support in high electrical fields which may exist near the conductive sheet during microwave irradiation. The dielectric support material has a dielectric loss factor less than 0.005, and a failure temperature greater than 101°C. The present invention relates to intrinsically nonarcing packages. A method for selecting packaging material for use in a shielded microwave container having a gain greater than 3 is also disclosed. A package material is selected having a combination of dielectric loss factor, heat capacity, density, and failure temperature, such that during microwave heating for a predetermined microwave heating time the failure temperature of the package material would not be exceeded.

대표청구항 ▼

A package for heating of food material representing a low load in a microwave environment employing a conductive sheet in close proximity to a dielectric material that is selected to minimize failure of the dielectric material during microwave heating, comprising: a conductive sheet, the conductive

A package for heating of food material representing a low load in a microwave environment employing a conductive sheet in close proximity to a dielectric material that is selected to minimize failure of the dielectric material during microwave heating, comprising: a conductive sheet, the conductive sheet being exposed to microwave radiation when the package is placed in a microwave oven and the oven is energized, the conductive sheet having an edge, the conductive sheet causing a gain in electrical field strength greater than 3 near at least a portion of an edge; a rigid, dimensionally stable dielectric support for the conductive sheet, the dielectric support being mechanically associated with the conductive sheet to maintain dimensional stability of the combination of the dielectric support and the conductive sheet, the dielectric support extending beyond at least a portion of an edge of the conductive sheet, the dielectric support being spaced less than 0.5 inch from the conductive sheet, the dielectric support being composed of material selected to avoid failure of the dielectric support in high electrical fields which may exist near the conductive sheet during microwave irradiation, the dielectric support material having a dielectric loss factor less than 0.005, the dielectric support material having a failure temperature greater than 101°C.; the package being an intrinsically nonarcing package; food supported by the package, the food representing a low load in a microwave oven cavity, where microwave cooking is continued for a predetermined period of time desired according to the food selected for the package when the package is placed in a microwave oven cavity.