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Photo chemical reaction apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/00
출원번호 US-0215175 (1988-07-05)
우선권정보 JP-0168028 (1987-07-06)
발명자 / 주소
  • Yano Kensaku (Kanagawa JPX) Furukawa Akihiko (Tokyo JPX) Miyagawa Ryohei (Kanagawa JPX) Iida Yoshinori (Tokyo JPX)
출원인 / 주소
  • Kabushiki Kaisha Toshiba (Kanagawa JPX 03)
인용정보 피인용 횟수 : 94  인용 특허 : 6

초록

A photo chemical reaction apparatus comprises a vacuum container partitioned into a reaction chamber and a carrier chamber by use of partition board. The partition board has an opening into which a carrier tray can be detachably inserted so as to cause the rection chamber to be hermetically sealed.

대표청구항

A photo chemical reaction apparatus for treating a workpiece with a reaction gas and light, comprising: a light source; movable carrier means for transporting workpieces to be photo chemically treated, including a carrier tray, having supporting means and a light-penetrating window for exposing a wo

이 특허에 인용된 특허 (6)

  1. Jackson Scott C. (Wilmington DE) Rocheleau Richard E. (Wilmington DE), Apparatus and method for photochemical vapor deposition.
  2. Harada Hiroshi (Tokyo JPX) Iwasawa Yoshiyuki (Tokyo JPX) Ishida Tsutomu (Tokyo JPX) Kobayashi Shintaro (Tokyo JPX), Semiconductor processing system.
  3. Shrader Robert L. (Castro Valley CA), Substrate transfer apparatus for a vacuum coating system.
  4. Feldman Charles (Washington DC) Charles Harry K. (Baltimore MD) Satkiewicz Frank G. (Ellicott City MD), Thin-film silicon solar cell with metal boride bottom electrode.
  5. Love Robert B. (Franklin TN), Vacuum deposition system and method.
  6. Dorenbos Frederick William (El Cerrito CA), Workpiece handling system for vacuum processing.

이 특허를 인용한 특허 (94)

  1. Park Jun Sig,KRX ; Kim Young Sun,KRX ; Kim Jung Ki,KRX, Apparatus and method for low pressure chemical vapor deposition using multiple chambers and vacuum pumps.
  2. Park Jun Sig,KRX ; Kim Young Sun,KRX ; Kim Jung Ki,KRX, Apparatus and method for low pressure chemical vapor deposition using multiple chambers and vacuum pumps.
  3. Nguyen,Tue; Nguyen,Tai Dung; Bercaw,Craig Alan, Assembly line processing method.
  4. Murata, Kazutoshi; Mori, Yasunari, Atomic layer deposition apparatus and thin film forming method.
  5. Beer, Emanuel; White, John M., Automated substrate processing system.
  6. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Conveying system for a vacuum processing apparatus.
  7. Lee,Jae Chull; Berkstresser,David, Curved slit valve door with flexible coupling.
  8. Lee, Jae-Chull; Kurita, Shinichi; White, John M.; Anwar, Suhail, Decoupled chamber body.
  9. Kurita, Shinichi; Blonigan, Wendell T., Double dual slot load lock chamber.
  10. Kurita, Shinichi; Blonigan, Wendell T.; Hosokawa, Akihiro, Dual substrate loadlock process equipment.
  11. Kurita, Shinichi; Blonigan, Wendell T.; Hosokawa, Akihiro, Dual substrate loadlock process equipment.
  12. Provencher, Timothy J.; Hickson, Craig B., High temperature ALD inlet manifold.
  13. Park, Kie Jin; Na, Jeong Seok; Lu, Victor, Ion-induced atomic layer deposition of tantalum.
  14. Kurita, Shinichi; Blonigan, Wendell T.; Tanase, Yoshiaki, Large area substrate transferring method for aligning with horizontal actuation of lever arm.
  15. Kurita,Shinichi; Blonigan,Wendell T.; Tanase,Yoshiaki, Load lock chamber for large area substrate processing system.
  16. Kurita,Shinichi; Blonigan,Wendell T., Load lock chamber having two dual slot regions.
  17. Lee, Jae-Chull; Anwar, Suhail; Kurita, Shinichi, Load lock chamber with decoupled slit valve door seal compartment.
  18. Aggarwal, Ravinder K.; Stoutjesdijk, Jeroen; Hill, Eric R.; Davis, Loring G.; DiSanto, John T., Load lock having secondary isolation chamber.
  19. Aggarwal, Ravinder; Stoutjesdijk, Jeroen; Hill, Eric; Davis, Loring G.; DiSanto, John T., Load lock having secondary isolation chamber.
  20. Raaijmakers,Ivo; Aggarwal,Ravinder; Kusbel,James, Loadlock with integrated pre-clean chamber.
  21. Nguyen, Tue; Nguyen, Tai Dung; Bercaw, Craig Alan, Method and system for sequential processing in a two-compartment chamber.
  22. Kurita,Shinichi; Blonigan,Wendell T., Method for transferring substrates in a load lock chamber.
  23. Greer, Frank; Leeser, Karl, Method of increasing the reactivity of a precursor in a cyclic deposition process.
  24. Greer, Frank; Leeser, Karl, Method of reducing plasma stabilization time in a cyclic deposition process.
  25. Chiang, Tony P.; Leeser, Karl, Modulated ion-induced atomic layer deposition (MII-ALD).
  26. John M. White ; Wendell T. Blonigan ; Michael W. Richter, Multi-function chamber for a substrate processing system.
  27. White John M. ; Blonigan Wendell T. ; Richter Michael W., Multi-function chamber for a substrate processing system.
  28. White John M. ; Blonigan Wendell T. ; Richter Michael W., Multi-function chamber for a substrate processing system.
  29. Kurita, Shinichi; Anwar, Suhail; Lee, Jae-Chull, Multiple slot load lock chamber and method of operation.
  30. Sakuma, Takeshi, Photo-excited gas processing apparatus for semiconductor process.
  31. Bluck, Terry; Scollay, Stuart; Tong, Edric, Processing thin wafers.
  32. Bluck, Terry; Scollay, Stuart; Tong, Edric, Processing thin wafers.
  33. Masayuki Murayama JP; Haruo Ozawa JP, Projection exposure apparatus.
  34. Dunn, Todd; White, Carl; Halpin, Mike; Shero, Eric; Terhorst, Herbert; Winkler, Jerry, Pulsed valve manifold for atomic layer deposition.
  35. Jurgensen, Holger; Bachem, Karl Heinz, Reactor for coating flat substrates and process for manufacturing such substrates.
  36. Ogawa Takashi,JPX, Semiconductor manufacturing apparatus.
  37. Yamagishi, Takayuki; Suwada, Masaei; Watanabe, Takeshi, Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections.
  38. Yamagishi,Takayuki; Suwada,Masaei; Watanabe,Takeshi, Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections.
  39. Fair, James A.; Taylor, Nerissa, Sequential UV induced chemical vapor deposition.
  40. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Substrate changing-over mechanism in a vaccum tank.
  41. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Substrate changing-over mechanism in vacuum tank.
  42. Dickinson, C. John; Jansen, Frank; Murphy, Daimhin P., Substrate processing apparatus and related systems and methods.
  43. Grant, Robert W.; Petrone, Benjamin J.; Mumbauer, Paul D., Systems and methods for achieving isothermal batch processing of substrates used for the production of micro-electro-mechanical-systems.
  44. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Transferring device for a vacuum processing apparatus and operating method therefor.
  45. Hiromi, Taichi; Murakami, Tadaaki, Tray, tray support member, and vacuum processing apparatus.
  46. Nakamura, Yukinori; Kashiwaya, Makoto; Kataoka, Takashi; Sohda, Hiroshi, Vacuum film deposition apparatus.
  47. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method.
  48. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method.
  49. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method using a vacuum chamber.
  50. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method with wafers, substrates and/or semiconductors.
  51. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus.
  52. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus.
  53. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  54. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  55. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  56. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  57. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  58. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  59. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  60. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  61. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  62. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  63. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  64. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  65. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  66. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  67. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  68. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  69. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  70. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  71. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  72. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  73. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  74. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  75. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  76. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  77. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  78. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  79. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method therefor.
  80. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method therefor.
  81. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  82. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  83. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  84. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  85. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  86. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsuenhiko; Itou,Atsushi, Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors.
  87. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors.
  88. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing equipment configuration.
  89. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing equipment configuration.
  90. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsuenhiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
  91. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
  92. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
  93. Kim, Sam Hyungsam; Lee, Jae-Chull; Sterling, William N.; Brown, Paul, Valve door with ball coupling.
  94. White, Carl L.; Shero, Eric, Vapor flow control apparatus for atomic layer deposition.
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