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Data carrier having an integrated circuit and a method for producing the same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06K-019/02
출원번호 US-0117541 (1987-11-06)
우선권정보 DE-3639630 (1986-11-20)
발명자 / 주소
  • Haghiri-Tehrani Yahya (Munich DEX)
출원인 / 주소
  • GAO Gesellschaft fur Automation und Organisation mbH (DEX 03)
인용정보 피인용 횟수 : 56  인용 특허 : 7

초록 ▼

The present invention relates to a data carrier having an integrated circuit and to a method for making the same. During production a carrier element equipped with an integrated circuit and contact surfaces is inserted into a recess in the data carrier blank. To allow for the carrier element to be f

대표청구항 ▼

A data carrier having at least one IC module for processing electrical signals, the IC module being disposed on a substrate which is small compared to the area of the data carrier, communicating via leads with contact elements also provided on the substrate which allow for communication of the IC mo

이 특허에 인용된 특허 (7)

  1. Hegi Paul (Bernex CHX), Card provided with a microprocessor and/or at least one electronic memory.
    상세보기
  2. Juan Alain (Chzard CHX), Electronic unit especially for microcircuit cards and card comprising such a unit.
    상세보기
  3. Hara Kazuya (Tokyo JPX) Rikuna Kenji (Tokyo JPX) Nakano Harumi (Tokyo JPX), IC card.
    상세보기
  4. Saito Tamio (Tokyo JPX) Ohuchi Masayuki (Tokyo JPX) Oodaira Hirosi (Chigasaki JPX) Fukumoto Yoshikatsu (Tokyo JPX) Hiranuma Shuji (Kawasaki JPX) Kishida Ko (Nara JPX) Kisaka Takanori (Yao JPX), IC card and method for manufacturing the same.
    상세보기
  5. Hoppe Joachim (Munich DEX) Haghiri-Tehrani Yahya (Munich DEX), Identification card having an IC module.
    상세보기
  6. Benge S. Eugene (Middletown OH) Froning Robert L. (Kettering OH), Method of making tags.
    상세보기
  7. Badet Bernard (Rosny-sous-Bois FRX) Guillaume Francois (St Leu la Foret FRX) Kurzweil Karel (Eaubonne FRX), Standardized information card.
    상세보기

이 특허를 인용한 특허 (56)

  1. Boccia,Henri; Brunet,Olivier; Patrice,Philippe; Limousin,Isabelle, Adapter for a chip card having a reduced format in comparison with the standard SIM mini-card format.
    상세보기
  2. Ghaem Sanjar ; O'Malley Grace ; Gore Kiron, Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly.
    상세보기
  3. DiStefano, Thomas H.; Karavakis, Konstantine; Mitchell, Craig; Smith, John W., Compliant integrated circuit package.
    상세보기
  4. Distefano Thomas H. ; Karavakis Konstantine ; Mitchell Craig ; Smith John W., Compliant integrated circuit package and method of fabricating the same.
    상세보기
  5. Suhir Ephraim (Randolph NJ), Data carriers having an integrated circuit unit.
    상세보기
  6. Haghiri-Tehrani Yahya,DEX ; Barak Renee-Lucia,DEX, Electronic module and a data carrier having an electronic module.
    상세보기
  7. Igor Y. Khandros ; Thomas H. Distefano, Face-up semiconductor chip assemblies.
    상세보기
  8. Mori,Haruhiko; Kanakubo,Masaru; Sakamoto,Hideyuki, Hybrid integrated circuit device and method of manufacturing the same.
    상세보기
  9. Sasaki, Koji; Saito, Naoto; Miura, Hideo; Ohta, Hiroyuki; Matsumoto, Kunio; Yoshino, Ryozo, IC card and its manufacturing method.
    상세보기
  10. Hosaka, Kazuhiro; Yodokawa, Seiji; Ono, Shuji; Moriya, Takehiko, IC module, IC card, and IC module substrate.
    상세보기
  11. Krappe,Anu; Str？mberg,Samuli, Injection moulded product and a method for its manufacture.
    상세보기
  12. Ayala, Stéphane; Carre, Lionel; Curty, Jari-Pascal, Manufacturing method for a dual interface card.
    상세보기
  13. Florek, Miroslav; Mihályová, Tatiana, Memory card.
    상세보기
  14. Kim,Seung Gu; Ryu,Chang Sup; Cho,Han Seo; Lee,Doo Hwan; Park,Hwa Sun, Method for manufacturing circuit board with built-in electronic components.
    상세보기
  15. Tarantino Thomas,DEX, Method for mounting an electronic module in a card body.
    상세보기
  16. Str？mberg,Samuli, Method for the manufacture of a smart label inlet web, and a smart label inlet web.
    상세보기
  17. DiStefano, Thomas H.; Karavakis, Konstantine; Mitchell, Craig; Smith, John W., Method of making a compliant integrated circuit package.
    상세보기
  18. Droz Franois (46 ; rue de la Prairie CH-2300 La Chaux-de-Fonds CHX), Method of manufacture of a card comprising at least one electronic element and card obtained by such method.
    상세보기
  19. Barak,Ren챕e Lucia; Riedel,Josef; Haghiri, deceased,Yahya, Method of producing a module.
    상세보기
  20. Igor Y. Khandros ; Thomas H. Distefano, Methods of making semiconductor chip assemblies.
    상세보기
  21. Khandros Igor Y. ; Distefano Thomas H., Methods of making semiconductor chip assemblies.
    상세보기
  22. Pflughaupt,L. Elliott; Gibson,David; Kim,Young Gon; Mitchell,Craig S.; Zohni,Wael; Mohammed,Ilyas, Microelectronic assembly having array including passive elements and interconnects.
    상세보기
  23. Khandros,Igor Y.; DiStefano,Thomas H., Microelectronic component and assembly having leads with offset portions.
    상세보기
  24. Khandros,Igor Y.; DiStefano,Thomas H., Microelectronic component and assembly having leads with offset portions.
    상세보기
  25. Takahira Kenichi,JPX ; Ohbuchi Jun,JPX ; Murasawa Yasuhiro,JPX, Non-contact type IC card.
    상세보기
  26. Masahiko Tsumori,JPX, Non-contact type IC card and method of producing the same.
    상세보기
  27. Tsao, Paul; Brown, Kerry D., Payment card manufacturing technology.
    상세보기
  28. Haas Kevin L. ; Gore Kiron P., Punch out pattern for hot melt tape used in smartcards.
    상세보기
  29. Khandros,Igor Y.; DiStefano,Thomas H., Semiconductor chip assemblies, methods of making same and components for same.
    상세보기
  30. Khandros,Igor Y.; Distefano,Thomas H., Semiconductor chip assemblies, methods of making same and components for same.
    상세보기
  31. Igor Y. Khandros ; Thomas H. DiStefano, Semiconductor chip assembly with anisotropic conductive adhesive connections.
    상세보기
  32. Khandros Igor Y. ; Distefano Thomas H., Semiconductor chip package with center contacts.
    상세보기
  33. Beals, William Michael; Goupil, Hervé, Smart card interface.
    상세보기
  34. Beals, William Michael; Goupil, Hervé, Smart card interface.
    상세보기
  35. Beals, William Michael; Goupil, Hervé, Smart card interface.
    상세보기
  36. Beals, William Michael; Goupil, Hervé, Smart card interface.
    상세보기
  37. Beals, William Michael; Goupil, Hervé, Smart card interface.
    상세보기
  38. Beals, William Michael; Goupil, Hervé, Smart card interface.
    상세보기
  39. Beals, William Michael; Goupil, Hervé, Smart card interface.
    상세보기
  40. Str？mberg,Samuli; Hanhikorpi,Marko, Smart label web and a method for its manufacture.
    상세보기
  41. Maus, Christopher; Maus, Brandon, Smartcard with iChip contact pad.
    상세보기
  42. Igor Y. Khandros ; Thomas H. DiStefano, Stacked chip assembly.
    상세보기
  43. Pflughaupt, L. Elliott; Gibson, David; Kim, Young-Gon; Mitchell, Craig S., Stacked packages.
    상세보기
  44. Pflughaupt, L. Elliott; Gibson, David; Kim, Young-Gon; Mitchell, Craig S.; Zohni, Wael; Mohammed, Ilyas, Stacked packages.
    상세보기
  45. Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, Systems and methods for performing transport I/O.
    상세보기
  46. Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, Systems and methods for performing transport I/O.
    상세보기
  47. Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, Systems and methods for performing transport I/O.
    상세보기
  48. Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, Systems and methods for performing transport I/O.
    상세보기
  49. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
    상세보기
  50. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
    상세보기
  51. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
    상세보기
  52. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
    상세보기
  53. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus and related methods.
    상세보기
  54. Perrine, Jerome; Goupil, Hervé; van Riek, Maurice Gerard; Beals, William Michael; Fischer, Nicolas; Ellis, Benjamin Brian; Duval, Gregory, USB interface for performing transport I/O.
    상세보기
  55. Leighton,Keith R., Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices.
    상세보기
  56. Schwandt, Sheldon Terry; Dehmoubed, Farzin; Infanti, James Carl; Lepp, James Randolph Winter; Los, Oleg, Universal integrated circuit card apparatus and related methods.
    상세보기

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