초록 ▼

A wafer array comprising a plurality of wafers of semiconductor material are stacked one on top of another. Through holes are provided in the wafers and electrically conductive liquid is inserted in the through holes for interconnecting all of the wafers. The conductive liquid is electrically insula

A wafer array comprising a plurality of wafers of semiconductor material are stacked one on top of another. Through holes are provided in the wafers and electrically conductive liquid is inserted in the through holes for interconnecting all of the wafers. The conductive liquid is electrically insulated from all parts of the wafers except a part comprising an electrically conductive bonding pad which provides an electrical path between the conductive liquid and transistors located in the wafers. The wafers, which are disposed in a stack one on top of the other, are mounted in an enclosure and coupled to electrical pin members for connection to external devices.

대표청구항 ▼

A wafer array comprising: a plurality of wafers of material which are disposed in a stack one on top of another; a through-hole in each of said wafers in said stack, said through-hole having an apex at one surface of said wafer and a base at the opposite surface of said wafer with an outwardly slopi

A wafer array comprising: a plurality of wafers of material which are disposed in a stack one on top of another; a through-hole in each of said wafers in said stack, said through-hole having an apex at one surface of said wafer and a base at the opposite surface of said wafer with an outwardly sloping sidewall extending from said apex to said base. first retaining means for retaining said through-hole in one of said wafers in said stack in registration with said through-hole in an adjacent wafer in said stack; an electrically conductive pad located adjacent to said apex of said through-hole in each of said wafers, said base of said through-hole being large enough to extend over the electrically conductive pad located adjacent to said apex of a through-hole in registration therewith on an adjacent wafer; an electrically conductive liquid which extends through said through-hole in each of said wafers for electrically connecting said electrically conductive pad on one of said wafers with said electrically conductive pad on said adjacent wafer; means for electrically isolating said electrically conductive liquid from exposed surfaces of said wafer material; and second and third retaining means located on the top and bottom of said stack, respectively for retaining said electrically conductive liquid in said through-holes, said third retaining means including means for electrically connecting said electrically conductive liquid to an external device.