초록 ▼

A subassembly for use in packaging an optoelectronic device (e.g., LED or photodiode) includes a semiconductor (e.g., silicon) base and lid having a variety of etched features (e.g., grooves, cavities, alignment detents) and metalization patterns (e.g., contacts, reflectors) which enable the device

A subassembly for use in packaging an optoelectronic device (e.g., LED or photodiode) includes a semiconductor (e.g., silicon) base and lid having a variety of etched features (e.g., grooves, cavities, alignment detents) and metalization patterns (e.g., contacts, reflectors) which enable the device to be reliably and inexpensively mounted on the base and coupled to the fiber.

대표청구항 ▼

A subassembly for an optoelectronic device comprising a semiconductor base having a major surface and a first groove in said surface capable of receiving a portion of an optical fiber, said first groove having side walls and an end face formed by crystallographic planes which are oblique to said sur

A subassembly for an optoelectronic device comprising a semiconductor base having a major surface and a first groove in said surface capable of receiving a portion of an optical fiber, said first groove having side walls and an end face formed by crystallographic planes which are oblique to said surface, an insulative layer formed on at least a portion of said surface, and metal contacts disposed on said layer, at least one of said contacts overlapping said end face and forming a reflector, said device being disposed over said reflector and connected to said contacts, so that said reflector directs light between said device and said fiber.