초록 ▼

In a system for cooling electronic circuit devices to be tested, e.g., LSIs a cooling fluid is sprayed against the cooling surface of an electronic circuit device to cool the device, and also air is supplied in the opposite direction to the flow of the cooling fluid to form an air curtain, thereby p

In a system for cooling electronic circuit devices to be tested, e.g., LSIs a cooling fluid is sprayed against the cooling surface of an electronic circuit device to cool the device, and also air is supplied in the opposite direction to the flow of the cooling fluid to form an air curtain, thereby preventing the cooling fluid from depositing on the electric circuitry of the devices.

대표청구항 ▼

A cooling system for at least one electronic circuit device having a surface to be cooled comprising: first means for spraying a liquid against the surface of the at least one electronic circuit device; and second means for supplying a gas so as to substantially surround at least a portion of a spra

A cooling system for at least one electronic circuit device having a surface to be cooled comprising: first means for spraying a liquid against the surface of the at least one electronic circuit device; and second means for supplying a gas so as to substantially surround at least a portion of a spray of said liquid and to flow in a direction opposite to the flow of said liquid to prevent said liquid from flowing into contact with circuitry associated with said device.