초록 ▼

An electrical circuit interconnect system employs an electrically conductive enclosure (57) and cover (64) which completely encompasses, hermetically seals (54) and electrically isolates from the outside environment a component (18) mounted on first surface of an insulating substrate (16) of a micro

An electrical circuit interconnect system employs an electrically conductive enclosure (57) and cover (64) which completely encompasses, hermetically seals (54) and electrically isolates from the outside environment a component (18) mounted on first surface of an insulating substrate (16) of a microwave circiut (56). A plurality of conductors (12) mounted on the first surface of the insulating substrate (16) electrically connect the component (18) to the outside electrical circuitry by passing under a corresponding plurality of pass-through bores (58) within the base of the enclosure (57). Specifically, within each respective passthrough bore (58), a corresponding glass encased conductor (60 and 62) electrically connects each conductor (12) within the enclosure to a conductor outside of the enclosure (57). A plurality of conductor paths (66) extend through bores in the insulating substrate (16) to electrically connect the enclosure (57) to a circuit ground plane (14) located on a second surface, opposite to the first surface, of the insulating substrate (16 ).

대표청구항 ▼

An assembly for electrically isolating at least one component mounted on an electrical circuit, said circuit comprising at least one conductor on a first surface of an insulating substrate and a ground plane over a second surface of said surface opposite said first surface, the assembly comprising:

An assembly for electrically isolating at least one component mounted on an electrical circuit, said circuit comprising at least one conductor on a first surface of an insulating substrate and a ground plane over a second surface of said surface opposite said first surface, the assembly comprising: a. an enclosure composed of conductive material mounted on said first substrate of said insulating substrate so as to enclose the component to be isolated, said enclosure forming at least one pass-through bore adjacent to said insulating substrate, said conductor electrically connected to said component through said pass-through bore; b. a cover composed of conductive material secured over said enclosure; and c. at least one conductive path from said enclosure extending to said ground plane through said insulating substrate.