초록

A method of building a multilevel electrical interconnect supported by metal pillars with air as a dielectric. The metal conductors and metal support pillars are formed using a photo-imagible polymer which serves the function of patterning and also provides a temporary support during construction.

대표청구항 ▼

A method of making a multilevel electrical airbridge interconnect on a substrate comprising, applying a metal seed layer over an underlying layer, selectively patterning a photopolymer mask on the metal seed layer, applying an electrically conductive layer on the unmasked portion of the metal seed l

A method of making a multilevel electrical airbridge interconnect on a substrate comprising, applying a metal seed layer over an underlying layer, selectively patterning a photopolymer mask on the metal seed layer, applying an electrically conductive layer on the unmasked portion of the metal seed layer for forming a first conductor lavel and a first part of metal support pillars, adding a second layer of a photopolymer mask for forming another part of the support pillars, applying another part of the metal support pillars to the first part of the metal support pillars, applying a second metal seed layer over the second mask and said another part layer of the metal pillars, repeating these steps one or more times for building additional levels of metal pillar supported conductors, and sequentially removing the seed and mask layers leaving electrical conductors supported from metal pillars with a dielectric therebetween.