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A fluid heat exchanger for cooling an electronic component including a housing having a fluid inlet and fluid outlet. Piezoelectric means are connected to a plurality of flexible blades for pumping fluid from the inlet to the outlet. A heat conductive structure is connected to the housing base for c

A fluid heat exchanger for cooling an electronic component including a housing having a fluid inlet and fluid outlet. Piezoelectric means are connected to a plurality of flexible blades for pumping fluid from the inlet to the outlet. A heat conductive structure is connected to the housing base for conducting heat to the fluid. The heat conductive structure may include the flexible blades and/or fixed metal fins.

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A fluid heat exchanger for cooling an electronic component comprising, a housing having a base for receiving heat from an electronic component, said housing having a fluid inlet and a fluid outlet, a plurality of flexible blades positioned in the housing, piezoelectric means connected to the blades

A fluid heat exchanger for cooling an electronic component comprising, a housing having a base for receiving heat from an electronic component, said housing having a fluid inlet and a fluid outlet, a plurality of flexible blades positioned in the housing, piezoelectric means connected to the blades for vibrating the blades to flow fluid from the inlet to the outlet, means in the housing connected to the base for conducting heat from the base to the flow of fluid, and said means for conducting heat from its base are the flexible blades which are of a heat conductive material.