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Microprocessor having high current drive and feedback for temperature control 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H03K-017/08
출원번호 US-0264732 (1988-10-31)
발명자 / 주소
  • Anderson Floyd E. (Phoenix AZ) Robb Stephen P. (Tempe AZ) Shaw Pern (Austin TX)
출원인 / 주소
  • Motorola Inc. (Schaumburg IL 02)
인용정보 피인용 횟수 : 39  인용 특허 : 7

초록

An integrated circuit having a microprocessor core interfaced to large power transistors is described. This integrated circuit provides the capability to intelligently control and drive loads requiring currents exceeding 250 milli amps. The large power transistors are built in a technology compatibl

대표청구항

A monolithically integrated circuit comprising: at least one power output device having a current drive capability of greater than 0.25 amps; a microprocessor core coupled to said at least one power output device for driving said at least one power output device; a temperature sensing means coupled

이 특허에 인용된 특허 (7)

  1. Burroughs Mark S. (Jonestown PA), Bi-modal temperature controller.
  2. Chiappetta Joseph F. (Trumbull CT), Detector circuit with dual-diode compensation.
  3. Premerlani, William J., Generalized real-time thermal model.
  4. Shimizu Yasuo (Saitama JPX), Motor-driven power steering system and method of controlling same.
  5. Morishita Mitsuharu (Himeji JPX) Kohge Shinichi (Himeji JPX), Motor-driven power steering system for a vehicle.
  6. Nagao Toshiaki (Muko JPX) Sukimoto Yasuyuki (Yahata JPX), Object temperature control device.
  7. Peil William (North Syracuse NY) Brown Thomas A. (Fulton NY) Dissosway Marc A. (Liverpool NY), Threshold amplifier for IC fabrication using CMOS technology.

이 특허를 인용한 특허 (39)

  1. Tagomori Reiji,JPX, Arrangement for supplying circuits with direct currents.
  2. Hebert, Francois, Co-packaging approach for power converters based on planar devices, structure and method.
  3. Sauciuc,Ioan; Chrysler,Gregory M.; Mahajan,Ravi V., Computer system having controlled cooling.
  4. Sachs,Jason M.; Heinzmann,John David, Dynamic current limiting.
  5. Pippin,Jack D., Fail-safe thermal sensor apparatus and method.
  6. Buonpane, Michael S.; Chlipala, James D.; Martin, Richard P.; Muscavage, Richard; Segan, Scott A., Integrated circuit performance enhancement using on-chip adaptive voltage scaling.
  7. Cooper, Christopher B.; Liu, Ming-Bo; Martin, Chris G.; Manning, Troy A.; Casper, Stephen L.; Dennison, Charles H.; Shirley, Brian M.; Brown, Brian L.; Batra, Shubneesh, METHOD OF STORING A TEMPERATURE THRESHOLD IN AN INTEGRATED CIRCUIT, METHOD OF MODIFYING OPERATION OF DYNAMIC RANDOM ACCESS MEMORY IN RESPONSE TO TEMPERATURE, PROGRAMMABLE TEMPERATURE SENSING CIRCUIT .
  8. Subramaniyam,Ganesh; Hammond,Gary, Method and apparatus for lowering the die temperature of a microprocessor and maintaining the temperature below the die burn out.
  9. Borys S. Senyk, Method and apparatus for monitoring the temperature of a processor.
  10. Pippin Jack D., Method and apparatus for programmable thermal sensor for an integrated circuit.
  11. Pippin,Jack D., Method and apparatus for programmable thermal sensor for an integrated circuit.
  12. Andersen,Kevin C.; Fifield,John A.; Pilo,Harold, Method and system for maintaining uniform module junction temperature during burn-in.
  13. Gunther, Stephen H.; Binns, Frank; Pippin, Jack D.; Rankin, Linda J.; Burton, Edward A.; Carmean, Douglas M.; Bauer, John M., Methods and apparatus for thermal management of an integrated circuit die.
  14. Gunther,Stephen H.; Binns,Frank; Pippin,Jack D.; Rankin,Linda J.; Burton,Edward A.; Carmean,Douglas M.; Bauer,John M., Methods and apparatus for thermal management of an integrated circuit die.
  15. Masanori Sugiyama JP; Hiroyuki Inagaki JP; Yoshihide Suzuki JP, Motor driving control device.
  16. Umemura Chiaki ; Sugiyama Masanori,JPX, Overheating protection system of switching module.
  17. Linda J. Rankin ; Edward A. Burton ; Stephen H. Gunther ; Jack D. Pippin, Programmable thermal management of an integrated circuit die.
  18. Ide Kazunori,JPX, Semiconductor device and method for discriminating bad semiconductor devices from good ones.
  19. Willkofer, Stefan; Kiep, Andreas, Sensing element for semiconductor.
  20. Hebert, Francois, Single die output power stage using trench-gate low-side and LDMOS high-side MOSFETS, structure and method.
  21. Hebert, Francois, Single die output power stage using trench-gate low-side and LDMOS high-side MOSFETS, structure and method.
  22. Hebert, Francois, Single die output power stage using trench-gate low-side and LDMOS high-side MOSFETs, structure and method.
  23. Bell, David B.; Hebert, Francois; Kelkar, Nikhil, Stacked power converter structure and method.
  24. Pippin, Jack D., Temperature averaging thermal sensor apparatus and method.
  25. Andrea Milanesi IT; Vanni Poletto IT; Paolo Ghigini IT, Temperature control system and method for an integrated circuit.
  26. Beatty Timothy S. ; McAllister Christopher P. ; Fletcher Thomas D., Temperature measurement and compensation scheme.
  27. Pippin, Jack D., Temperature-based clock frequency controller apparatus and method.
  28. Pippin, Jack D., Temperature-based cooling device controller apparatus and method.
  29. Pippin, Jack D., Temperature-based cooling device controller apparatus and method.
  30. Zuniga, Marco A.; Cassella, Craig, Testing of LDMOS device.
  31. Thomas C. Douglass ; Thomas Alan E., Thermal and power management for computer systems.
  32. Thomas,C. Douglas; Thomas,Alan E., Thermal and power management for computer systems.
  33. Thomas,C. Douglass; Thomas,Alan E., Thermal and power management for computer systems.
  34. Thomas,C. Douglass; Thomas,Alan E., Thermal and power management for computer systems.
  35. Thomas,C. Douglass; Thomas,Alan E., Thermal and power management for computer systems.
  36. C. Douglass Thomas ; Alan E. Thomas, Thermal and power management to computer systems.
  37. Evoy David Ross, Thermal management device and method for a computer processor.
  38. David Robert Arslain ; Richard Joseph Ravas, Jr. ; Ashraf Kamal Kamel, Thermal management of an electronic switch.
  39. Gibson Gary S., Thermal shutdown circuit and method for sensing thermal gradients to extrapolate hot spot temperature.
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