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|국가/구분||United States(US) Patent 등록|
|국제특허분류(IPC7판)||H05B-041/00 H05K-001/03 H05K-005/02 H05K-007/14|
|미국특허분류(USC)||315/363 ; 361/397 ; 361/399 ; 361/400|
|발명자 / 주소||
|인용정보||피인용 횟수 : 16 인용 특허 : 10|
The present invention relates to an improved three-dimensional printed circuit board and a plastic housing for power conditioning electronics such as fluorescent lamp ballasts. The novel printed circuit board of the invention is a molded printed circuit board which is generally a rectangular parallelepiped having an upper relatively plain surface and a lower relatively plain surface but in addition having integral components thereon which extend for example above the upper relatively plain surface. Such integral components extending in this direction can...
A metalless unpotted housing for an electronic power conditioning apparatus subject to heat generated by said apparatus, required to meet weather and shock standards, said housing comprising: a plurality of thermoplastic housing components fitted together to form a closed, integral housing, at least one of said thermoplastic housing components having an aperture for receiving a conductor receptacle, a three dimensional molded printed circuit board supported within said housing, said three dimensional molded printed circuit board having: a lower, generall...