초록 ▼

A method and apparatus are described which enhance the ablative effect of a UV laser. The ablative effect of a pulsed UV laser is enhanced using a second, longer wavelength pulsed laser. Each pulse of the first laser is followed by or combined with a pulse from the second laser. The etch depth per p

A method and apparatus are described which enhance the ablative effect of a UV laser. The ablative effect of a pulsed UV laser is enhanced using a second, longer wavelength pulsed laser. Each pulse of the first laser is followed by or combined with a pulse from the second laser. The etch depth per pulse is controlled by varying the time between pulses from the first and second lasers. The maximum etch depth per pulse occurs at a time separation which is a function of the substrate being etched. The first laser wavelength is selected to be within the absorption spectrum of the unexcited surface molecules of the substrate, while the wavelength of the second laser is selected to be within the absorption spectrum of the surface molecules excited by the incident radiation of the first laser.

대표청구항 ▼

A method of ablating a portion of a substrate, comprising the steps of: exposing said substrate to a first radiation pulse at a first ultraviolet wavelength; and exposing said substrate to a second radiation pulse at a second, longer ultraviolet wavelength, at least one of said first or second radia

A method of ablating a portion of a substrate, comprising the steps of: exposing said substrate to a first radiation pulse at a first ultraviolet wavelength; and exposing said substrate to a second radiation pulse at a second, longer ultraviolet wavelength, at least one of said first or second radiation pulses being of sufficient energy fluence to exceed the threshold for ablative photodecomposition of said substrate.