$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Foldable printed circuit board 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0274571 (1988-11-23)
발명자 / 주소
  • Porter Warren W. (Escondido CA) Lauffer Donald K. (Poway CA)
출원인 / 주소
  • NCR Corporation (Dayton OH 02)
인용정보 피인용 횟수 : 40  인용 특허 : 11

초록 ▼

A printed circuit board assembly is disclosed which includes a number of rigid printed circuit boards connected by a number of flexible printed circuit panels. Integrated circuits and similar components are mounted on the rigid printed circuit boards. The components are interconnected by printed cir

대표청구항 ▼

A printed circuit apparatus including a container, comprising: a plurality of rigid printed circuit boards; a width of each of said plurality of rigid printed circuit boards is less than the maximum transverse extend of said container; at least two flexible printed circuit panels, each said flexible

이 특허에 인용된 특허 (11)

  1. Miniet Jay J. (Fort Lauderdale FL), Double-sided flexible electronic circuit module.
    상세보기
  2. Damerow Milton F. (Paway CA) Kocin Michael J. (San Diego CA), Dual printed circuit board module.
    상세보기
  3. Sarnezki Herbert (Munich DEX) Schlemmer Torsten (Munich DEX), Electronic device with densely packed components.
    상세보기
  4. Pappas Nicholas L. (Sunnyvale CA), Flexible mounting support for wafer scale integrated circuits.
    상세보기
  5. Kraft Robert W. (Indianapolis IN), Flexible printed circuit board assembly.
    상세보기
  6. Miniet Jay J. (Ft. Lauderdale FL), Flexible printed circuit board having integrated circuit die or the like affixed thereto.
    상세보기
  7. Wedertz Larry D. (Mira Loma CA) Ross Oakley G. (Upland CA), Flexible printed circuit card assembly.
    상세보기
  8. Brainard ; II Edward C. (Marion MA), Portable memory module.
    상세보기
  9. Masselin Michel (Velizy-Villacoublay FRX), Set of power semiconductors equipped with firing transformers and with protection circuits.
    상세보기
  10. Stillie Donald G. (Winston-Salem NC) Zakary Paul D. (Winston-Salem NC), Shielded elastomeric electric connector.
    상세보기
  11. Kobayashi Gai (Amagasaki JA) Shikano Yoshiro (Amagasaki JA) Yano Masao (Amagasaki JA), Vapor cooling device for semiconductor device.
    상세보기

이 특허를 인용한 특허 (40)

  1. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem.
    상세보기
  2. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow.
    상세보기
  3. Fukuda, Masahiko, Apparatus for mounting a bicycle electrical component.
    상세보기
  4. Goren, Yehuda G.; Chen, Tong, Asymmetrical slow wave structures to eliminate backward wave oscillations in wideband traveling wave tubes.
    상세보기
  5. Dupriest, Charles Donald, Cable and method.
    상세보기
  6. Attlesey, Chad Daniel; Klum, R. Daren; Berning, Allen James, Case for a liquid submersion cooled electronic device.
    상세보기
  7. Bruce, Ted; Forthun, John A., Chip stack with differing chip package types.
    상세보기
  8. Scott Richard, Device having a flexible circuit disposed within a conductive tube and method of making same.
    상세보기
  9. Eriksen, Mikael Kristian; Kristiansen, Karstein; Volent, Kjetil Zsolt, Electrical subsea node.
    상세보기
  10. Cutting Lawrence R. ; Gaynes Michael A. ; Johnson Eric A. ; Milkovich Cynthia S. ; Perkins Jeffrey S. ; Pierson Mark V. ; Poetzinger Steven E. ; Zalesinski Jerzy, Electronic package assembly.
    상세보기
  11. Barth,Phillip W.; Killeen,Kevin, Extensible spiral for flex circuit.
    상세보기
  12. Cutting Lawrence R. ; Gaynes Michael A. ; Johnson Eric A. ; Milkovich Cynthia S. ; Perkins Jeffrey S. ; Pierson Mark V. ; Poetzinger Steven E. ; Zalesinski Jerzy, Flexible circuit board and common heat spreader assembly.
    상세보기
  13. Anderson David Allen ; Myers Carol Rita ; Saari Matthew John, Flexible multilayer printed circuit boards and methods of manufacture.
    상세보기
  14. Yoichiro Kondo JP, Flexible printed circuit and semiconductor device.
    상세보기
  15. Rieke, Matthias; Klink, Volker; Badarau-Trescovan, Florin, Heat dissipation device for an electronic device.
    상세보기
  16. Kato, Tetsuhiro; Nagatani, Naoyuki, Heat-conducting foam sheet for electronic devices.
    상세보기
  17. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
    상세보기
  18. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
    상세보기
  19. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems.
    상세보기
  20. Attlesey, Chad Daniel; Klum, R. Daren; Berning, Allen James, Liquid submersion cooling system.
    상세보기
  21. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
    상세보기
  22. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit.
    상세보기
  23. Akihiko Okubora JP; Takahiko Kosemura JP, Method for practically loading transmission or receiving module for optical link and its rigid flexible board.
    상세보기
  24. Blazier Michael Wayne ; Stephan Frank Martin, Method of forming assemblies of circuit boards in different planes.
    상세보기
  25. Blazier, Michael Wayne; Stephan, Frank Martin, Method of forming assemblies of circuit boards in different planes.
    상세보기
  26. Blood, James E.; Sweeney, Moira B.; Kane, Michael J., Multi-folded printed wiring construction for an implantable medical device.
    상세보기
  27. Sanjiv Singh Samant ; Jinesh Jitendra Jain ; Joseph Laughter, Multilayered board comprising folded flexible circuits.
    상세보기
  28. Samant, Sanjiv Singh; Jain, Jinesh Jitendra; Laughter, Joseph, Multilayered board comprising folded flexible circuits and method of manufacture.
    상세보기
  29. Williams, Anthony David, Noise canceling technique for frequency synthesizer.
    상세보기
  30. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Open flow cold plate for immersion-cooled electronic packages.
    상세보기
  31. Sone,Hidemi, Optical transceiver using optical sub-assembly having multiple lead pins connected to the substrate by a flexible printed circuit.
    상세보기
  32. Stopperan Jahn J., Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board.
    상세보기
  33. Goren, Yehuda G.; Lally, Philip M., Slow wave structure having offset projections comprised of a metal-dielectric composite stack.
    상세보기
  34. Barth, Phillip W., Strain relief structures for lead connections.
    상세보기
  35. Davis, Julian R., Subsea electronics module.
    상세보기
  36. Shelnutt, Austin Michael; Curlee, James D.; Bailey, Edmond I.; Sekel, Joseph M.; Stuewe, John R.; Mills, Richard Steven, System and method for powering multiple electronic devices operating within an immersion cooling vessel.
    상세보기
  37. Pant Bharat B. ; Spielberger Richard K., Three axis sensor package on flexible substrate.
    상세보기
  38. Jang Kyung-Woo,KRX, Three dimensional composite circuit board.
    상세보기
  39. Hinkle, Jonathan Randall, Tubular memory module.
    상세보기
  40. Alameh Rachid M. ; Krenz Eric L. ; Schellinger Michael W., Wrist-carried radiotelephone.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로