초록 ▼

Inspection of a circuit board (10) to detect missing and misaligned active and passive surface-mounted components (12) and (14), respectively, is accomplished by first illuminating the board with top light to enhance the image of the passive components. The circuit board is then displaced, relative

Inspection of a circuit board (10) to detect missing and misaligned active and passive surface-mounted components (12) and (14), respectively, is accomplished by first illuminating the board with top light to enhance the image of the passive components. The circuit board is then displaced, relative to a linescan camera (28) trained on the board, so that the camera captures the image of successive strips of surface area running across the board perpendicular to its direction of movement. The images captured by the camera (28) are stored and thereafter processed by an image-processing system (33) to determine whether any passive component is missing or misaligned. The circuit board is then illuminated with side light to enhance the image of the active components. The circuit board is again displaced relative to the linescan camera so the camera captures the image of successive strips of surface area on the board. The captured images are stored and then processed by the image-processing system to detect whether any of the active surface-mounted components are missing or misaligned.

대표청구항 ▼

A method of fabricating a substrate comprising the steps of: placing at least one of a first type and at least one of a second type of component, having electrically conductive members, on a substrate so that each of the components has its conductive members in registration with corresponding metall

A method of fabricating a substrate comprising the steps of: placing at least one of a first type and at least one of a second type of component, having electrically conductive members, on a substrate so that each of the components has its conductive members in registration with corresponding metallized areas on the substrate; adhering the first and second types of components to the substrate; and soldering the conductive members of the components to the substrate, characterized in that prior to the soldering step, the substrate is inspected to detect whether any of the first and second types of components are missing or misaligned, the inspection being accomplished by the steps of: (a) illuminating the substrate with top light by directing light at the surface of the substrate so the light strikes the board substantially normal to the plane of the substrate surface to enhance the image of the conductive members of the first type of component; (b) capturing, with a linescan camera, the image of a thin strip of area running across the surface of the substrate; (c) imparting a relative motion between the substrate and the linescan camera so the camera captures the image of successive strips of surface area running across the board; (d) storing the captured images for subsequent processing to determine if any of the first type of component are missing or misaligned; (e) illuminating the substrate with side light by directing light at the substrate at a grazing angle wth respect to the surface to enhance the image of the conductive members on the second type of component; (f) imparting a relative motion between the substrate and the linescan camera so the camera captures the image of successive strips of surface area running across the substrate; and (g) storing the captured images for subsequent processing to determine if any of the second type of component are missing or misaligned.