[특허]Method of using laser routing to form a rigid/flex circuit board

[미국특허] Method of using laser routing to form a rigid/flex circuit board 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B44C-001/22 B29C-037/00 C03C-015/00 C23F-001/02
출원번호	US-0394065 (1989-08-15)
발명자 / 주소	Hatkevitz Zvi (Andover MA) Maylor Ken (Danvers MA) Jacques Roland (Lowell MA)
출원인 / 주소	Parlex Corporation (Methuen MA 02)
인용정보	피인용 횟수 : 59 인용 특허 : 12

초록 ▼

A method of fabricating a multilayer circuit board having rigid and flexible sections using Z-axis laser routing. A rigid superstructure is provided for lamination to a flexible circuit substrate, wherein the superstructure includes specially configured strips of laser reflective material, disposed on the laminating surface thereof, defining the boundary between the rigid and flexible sections of the multilayer circuit board. In subsequent processing, a beam of laser energy is directed through the rigid superstructure, along the Z-axis thereof, superjacent to each strip of laser reflective material, thereby cutting through the material of the superstructure creating a laser routed channel which forms an interface between the rigid and flexible sections of the finished multilayer circuit board. In a further step, the portion of the rigid superstructure residing between the laser routed channels is separated and removed, there by exposing the underlying flexible substrate, resulting in a flexible section on an otherwise rigid laminated composite and creating a multilayer rigid/flex circuit board.

대표청구항 ▼

A method of fabricating a multilayer circuit board having rigid and flexible sections, by Z-axis laser routing, comprising the steps of: forming a rigid superstructure having a laminating surface and an opposing surface, said laminating surface having at least one strip of laser reflective material disposed thereon, said strips defining a boundary between the rigid and flexible sections of said multilayer circuit board; providing a flexible substrate for lamination to said rigid superstructure; applying an adhesive material to selective areas intermediate said rigid superstructure and the flexible substrate, said selective areas corresponding to a section designated to be rigid on said multilayer circuit board; laminating said rigid superstructure to the flexible substrate forming a rigid laminate composite, wherein said strips of laser reflective material abut the flexible substrate; directing laser energy at said rigid superstructure in alignment with said strips of laser reflective material, forming a laser routed channel through said rigid superstructure terminating at said strip of laser reflective material, said channel defining an interface between said rigid and flexible sections on said multilayer circuit board; and removing selected sections of said rigid superstructure between said laser routed channels to expose selected sections of the flexible substrate, forming said multilayer circuit board having rigid and flexible sections.

이 특허에 인용된 특허 (12) 인용/피인용 타임라인 분석

Hargis Billy M. (Hugo MN), Array of electronic packaging substrates.
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Ho Chung W. (Chappaqua NY), Discretionary fly wire chip interconnection.
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Johnson Morgan (Woodside CA), Electrical circuitry.
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Becker Charles A. (Rexford NY), High density electronic circuits having very narrow conductors.
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Pellegrino Peter P. (216 Edgewood La. Apple Valley MN 55124), Method and apparatus for mass producing printed circuit boards.
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Camps Patrick (St. Etienne FRX) Roset Pierre (Les Ulis FRX), Method of assembly of at least two components of ceramic material each having at least one flat surface.
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Becker Charles A. (Rexford NY), Method of fabricating high density electronic circuits having very narrow conductors.
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Johnson Morgan (Woodside CA), Method of making electrical circuitry.
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Quaschner Wolfgang (Geldern DEX), Process for making circuit boards having rigid and flexible areas.
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Obstfelder Gnther (Weinheim-ltzelsachsen DEX) Kreutze Gerhard (Neckarsteinach DEX) Lttig Winfried (Heiligkreuzsteinach DEX), Process for the fabrication of thermal printing boards in multilayer thick-film technology.
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Compton Peter M. (Aloha OR), Staggered ground-plane microstrip transmission line.
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Pond Ramona G. (Downey CA) Vitriol William A. (Anaheim CA) Brown Raymond L. (Riverside CA), Trimming passive components buried in multilayer structures.
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이 특허를 인용한 특허 (59) 인용/피인용 타임라인 분석

Stahr, Johannes; Morianz, Mike, Circuit board structure.
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Peters, Michael G.; McCormack, Mark Thomas; Bernales, Aris, Composite interposer and method for producing a composite interposer.
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Nikaido, Shinichi; Maruo, Hiroki, Connection configuration for rigid substrates.
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Beilin Solomon I. ; Chou William T. ; Kudzuma David ; Lee Michael G. ; Peters Michael G. ; Roman James J. ; Swamy Som S. ; Wang Wen-chou Vincent ; Moresco Larry L. ; Murase Teruo, Controlled impedence interposer substrate.
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Davis Charles R. (Wappingers Falls NY) Egitto Frank D. (Binghamton NY) Skarvinko Eugene R. (Binghamton NY), Design of high density structures with laser etch stop.
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Tan, Ming Yen, Double sided flexible printed circuit board.
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Sato, Akihiro; Sasaki, Masahiro; Ohmi, Tadahiro; Morimoto, Akihiro, Flex-rigid printed wiring board and manufacturing method thereof.
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Sato, Akihiro; Sasaki, Masahiro; Ohmi, Tadahiro; Morimoto, Akihiro, Flex-rigid printed wiring board and manufacturing method thereof.
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Nakamura, Shigehiro; Itou, Toshihiko; Joumen, Masayoshi; Mansei, Youichirou, Flexible multilayer wiring board.
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Wakimoto, Yuji; Watanabe, Toshihiro; Moriya, Ryuji, Flexible printed circuit board and manufacturing method.
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Lee, Chang-Jae; Ko, Tae-Ho; Kang, Jun-Ho, Flexible printed circuit board and manufacturing method thereof.
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Lee, Yang Je; Shin, Jae Ho; Kim, Ha Il; Yang, Dek Gin, Flying tail type rigid-flexible printed circuit board.
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Larsen,James E., Glass masking method using lasers.
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Danjo, Kenzo; Isii, Hideo; Katooka, Masao; Yokoyama, Shuji, Heat sink arrangement for electrical apparatus.
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Wang Wen-chou Vincent ; Takahashi Yasuhito ; Chou William T. ; Peters Michael G. ; Lee Michael G. ; Beilin Solomon, High density signal interposer with power and ground wrap.
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Schmidt Walter,CHX ; Martinelli Marco,CHX, Insulating foil circuit board with rigid and flexible sections.
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Cutting Lawrence R. (Owego NY) Gaynes Michael A. (Vestal NY) Johnson Eric A. (Greene NY) Milkovich Cynthia S. (Vestal NY) Perkins Jeffrey S. (Endwell NY) Pierson Mark V. (Binghamton NY) Poetzinger St, Manufacturing flexible circuit board assemblies with common heat spreaders.
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Trpkovski,Paul, Masking glass shapes.
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Trpkovski,Paul, Masking machine.
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Weidinger, Gerald; Zluc, Andreas; Stahr, Johannes, Method for making contact with a component embedded in a printed circuit board.
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Liu, Rui-Wu; Lee, Yu-Hsien; Yu, Wen-Hsin, Method for manufacturing printed circuit board.
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Li, Biao, Method for manufacturing rigid-flexible printed circuit board.
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Ren, Lin; Su, Ying; Lin, Cheng-Hsien, Method for manufacturing rigid-flexible printed circuit board.
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Wang, Ming-De; Huang, Li, Method for manufacturing rigid-flexible printed circuit board.
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Götzinger, Siegfried; Yao, ShuYing; Tuominen, Mikael; Han, Beck, Method for producing a circuit board and use of such a method.
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Stahr, Johannes; Leitgeb, Markus, Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board.
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Schmidt Walter,CHX ; Martinelli Marco,CHX, Method for producing foil circuit boards.
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Sakaki, Takashi; Yoshizawa, Tetsuo; Miyazaki, Toyohide; Kondo, Hiroshi; Terayama, Yoshimi; Ikegami, Yuichi; Okabayashi, Takahiro; Kondo, Kazuo; Tamura, Yoichi; Nakatsuka, Yasuo, Method of making an electrical connecting member.
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Kishimoto, Kunio; Nishii, Toshihiro; Takenaka, Toshiaki; Nakamura, Shinji; Miura, Akihiro, Method of manufacturing a circuit board and its manufacturing apparatus.
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Toyoshima, Ryoichi, Method of manufacturing a multilayer flexible printed circuit board.
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Kawamoto, Eiji; Yamane, Shigeru; Takenaka, Toshiaki, Method of manufacturing printed circuit board.
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Lee, Yang Je; Shin, Jae Ho; Yang, Dek Gin, Method of manufacturing rigid-flexible printed circuit board.
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Lee, Yang Je; Shin, Jae Ho; Yang, Dek Gin, Method of manufacturing rigid-flexible printed circuit board.
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Aigner, Robert; Pl?tz, Florian; Michaelis, Sven; Brauer, Michael, Method of producing micromechanical structures.
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Jones, Brian; Weber, Robert; Addington, Cary G; Choy, Si-Lam, Method of using a flexible circuit.
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DiStefano Thomas H. ; Grube Gary W. ; Khandros Igor Y. ; Mathiew Gaetan, Methods of making semiconductor connection components with releasable load support.
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Fjelstad Joseph ; Smith John W., Microelectronic lead structures with dielectric layers.
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Thomas H. DiStefano ; Gary W. Grube ; Igor Y. Khandros ; Gaetan Mathiew, Mounting component with leads having polymeric strips.
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Yamazaki, Hiroshi; Hasegawa, Mineyoshi; Tanigawa, Satoshi, Multi-layer wiring circuit board and method for producing the same.
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Lee, Yang Je; Yang, Dek Gin; An, Dong Gi; Shin, Jae Ho, Multilayer rigid flexible printed circuit board and method for manufacturing the same.
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Zadesky, Stephen P.; Prest, Christopher D.; Lynch, Stephen Brian, Portable electronic device with multipurpose hard drive circuit board.
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Ahn Jung-Hyun,KRX ; Lee Jong-Hyun,KRX, Printed circuit board.
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Heismann, Bj?rn; Spreiter, Quirin; Winkelmann, Helmut, Printed circuit board arrangement.
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Lee, Bruce W.; Swoboda, David G., Printed wiring board with high density inner layer structure.
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Conrad, Rachel P, Re-closable, tamper-resistant, stand-up package.
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Peters Michael G. ; Wang Wen-chou Vincent ; Takahashi Yasuhito ; Chou William ; Lee Michael G. ; Beilin Solomon, Reduced cross-talk noise high density signal interposer with power and ground wrap.
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R. Richard Steiner ; Shiuh-Kao Chiang, Resin/copper/metal laminate and method of producing same.
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Steiner, R. Richard; Chiang, Shiuh-Kao, Resin/copper/metal laminate and method of producing same.
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Chen, Chi-Shiang; Hu, Hsiu-Ching; Li, Kun-Wu; Wu, Fang-Ping, Rigid flex board module and the manufacturing method thereof.
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Kang, Jung Eun; Choi, Seog Moon; Kim, Tae Hoon; Lee, Young Ki; Shin, Hye Sook; Lim, Chang Hyun, Rigid-flexible circuit board and method of manufacturing the same.
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Otsubo, Yoshihito; Yoshikawa, Takayoshi; Takezawa, Akinori, Rigid-flexible substrate and method for manufacturing the same.
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McKenney Darryl ; Demaso Arthur ; Wilson Craig, Rigid/flex printed circuit board and manufacturing method therefor.
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DiStefano Thomas H. ; Grube Gary W. ; Khandros Igor Y. ; Mathiew Gaetan, Semiconductor connection components and methods with releasable lead support.
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Forman, Harold M.; Forman, Jo Anne; Oberholtzer, Lisa Ann; Cappa, Jr., Harry J., Tape sealed reclosable bag.
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IPC	Description
A	생활필수품
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A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Method of using laser routing to form a rigid/flex circuit board 원문보기