초록 ▼

A molded thermoplastic housing (100) includes base (102) and cover (104) members joined by a living hinge (106). The base member (102) includes a peripheral wall (108). Four solderable printed circuit patterns (112, 114, 116 and 118) are vacuum deposited onto the interior and exterior surfaces of bo

A molded thermoplastic housing (100) includes base (102) and cover (104) members joined by a living hinge (106). The base member (102) includes a peripheral wall (108). Four solderable printed circuit patterns (112, 114, 116 and 118) are vacuum deposited onto the interior and exterior surfaces of both housing members. The printed circuit patterns on opposing surfaces of the base and cover members are joined by conductive through-holes (e.g., 120 and 122), while the printed circuit patterns on the interior surfaces of the base and cover members are joined by an interconnecting printed circuit pattern (124) which is vacuum deposited onto the living hinge. Mylar sheets (132) are adhered to the exterior surface of the housing to insulate the exterior printed circuit patterns. An antenna pattern (126) is also vacuum deposited onto an exterior surface of the housing. A switch (136) and battery contact (152) are integrally formed with the housing and an integrally molded structural support means strenghthens the housing members. The housing is manufactured “opened up” and, at the final assembly stage, the cover member is rotated about the hinge until it contacts the upper surface of the peripheral wall (108B). Snap-fit connectors (e.g., 110) join the cover to the base.

대표청구항 ▼

A moldable/foldable housing for an electronic device comprising in combination: first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded; a first solderable printed circuit pattern disposed directly on a first surface of s

A moldable/foldable housing for an electronic device comprising in combination: first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded; a first solderable printed circuit pattern disposed directly on a first surface of said first housing member; a second printed circuit pattern disposed on a second surface of said first housing member, said second surface opposing said first surface; and a conductive through-hole connected between said first and second printed circuit patterns.