초록 ▼

High heat generation member of electronic integrated circuit etc. is boiled and cooled. A refrigerant steam is generated by cooling of the heat generation member and is condensed by a condenser which is provided an upper portion. A refrigerant steam flow path and a condensed refrigerant flow path fr

High heat generation member of electronic integrated circuit etc. is boiled and cooled. A refrigerant steam is generated by cooling of the heat generation member and is condensed by a condenser which is provided an upper portion. A refrigerant steam flow path and a condensed refrigerant flow path from the condenser are separated with a partition wall. The condensed liquid sent back to the partition wall is supplied to the heat generation member through the partition wall.

대표청구항 ▼

A semiconductor cooling apparatus comprising: a container having enclosed a refrigerant liquid therein; a substrate having mounted a plurality of semiconductor elements thereon and dipped in said refrigerant liquid of said container; a condenser disposed at an upper portion of said container and con

A semiconductor cooling apparatus comprising: a container having enclosed a refrigerant liquid therein; a substrate having mounted a plurality of semiconductor elements thereon and dipped in said refrigerant liquid of said container; a condenser disposed at an upper portion of said container and condensing a generated refrigerant steam; a partition wall for separating a flow path of ascending refrigerant steam generated by cooling said semiconductor elements and a flow path of descending refrigerant liquid condensed by said condenser; and a plurality of guide flow paths, provided on said partition wall for sending said condensed refrigerant liquid from said flow path of descending refrigerant liquid to a semiconductor element side of said partition wall; wherein said guide flow paths are corresponding positioned relative to said semiconductor elements to respectively supply condensed refrigerant liquid from said flow path of descending refrigerant liquid to each of said semiconductor elements.