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Modular segment adapted to provide a passively cooled housing for heat generating electronic modules 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0401719 (1989-09-01)
발명자 / 주소
  • Harris Michael P. (San Diego CA)
출원인 / 주소
  • General Dynamics Corporation, Space Systems Div. (San Diego CA 02)
인용정보 피인용 횟수 : 44  인용 특허 : 3

초록

A modular segment that is adapted to receive heat generating electronic assemblies therewithin. The modular segments may be joined together to form a housing and the electronic assemblies are electrically interconnected through a hollow channel provided in the joined modular segments. The segments a

대표청구항

A modular segment adapted to provide a passively cooled housing for a heat generating electronic assembly and comprising: a generally rectangular vertically extending hollow box beam shaped portion that provides a vertically extending hollow channel; the box beam portion including three vertically e

이 특허에 인용된 특허 (3)

  1. Murphy John E. (Los Angeles CA) Gardner William T. (Los Angeles CA), Electronic module with self-activated heat pipe.
  2. Buron Douglas J. (Plantation FL) Steinman Sheldon (Miramar FL) Wray Donald L. (Lauderhill FL), Modular expandable housing arrangement for electronic apparatus.
  3. Penn Paul E. (Indianapolis IN), Solid state device package mounting method.

이 특허를 인용한 특허 (44)

  1. Clinard,Kristopher Michael, Adjustable power supply housing with compensating air baffle.
  2. Barsun,Stephan K., Airflow control baffle.
  3. Steenwyk, Meredith Marie; Coxon, Danny Weldon; Streyle, John Jay; Vander Ploeg, Benjamin Jon, Avionics chassis.
  4. Streyle, John Jay; Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon, Avionics chassis.
  5. Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon; Horton, Paul James; Streyle, John Jay, Avionics chassis.
  6. Nicolici Radu-Marko,CAX ; Barber Robert J.,CAX ; Weber John F.,CAX, Casing mountable filler module.
  7. Gustine, Gary; Ham, Charles; Kusz, Matthew; Sawyer, Michael, Clamping case.
  8. Gustine,Gary; Ham,Charles; Kusz,Matthew J.; Sawyer,Michael, Clamping case.
  9. Gustine, Gary; Ham, Charles; Kusz, Matthew; Sawyer, Michael, Clamping receptacle.
  10. Gustine,Gary; Ham,Charles; Kusz,Matthew; Sawyer,Michael, Clamping receptacle.
  11. Brooks,Michael A.; Larson,Thane M., Computer cooling system and method.
  12. Chiang,Lien Jin; Chen,Chun Chen, Electronic apparatus with natural convection structure.
  13. Suzuki Masumi,JPX ; Ueda Akira,JPX, Electronic device having IC card slot.
  14. Hockett, John E., Electronics box having internal circuit cards interconnected to external connectors sans motherboard.
  15. Chang Juei-Chi,TWX, Heat dissipation apparatus.
  16. Ferris, Matthew D.; Petersen, Cyle D., Heat dissipation for electronic enclosures.
  17. Shuy, Geoffrey Wen-Tai, Heat exchange enhancement.
  18. Bock Uwe (Singen DEX), Heat exchanger for cooling semi-conductor elements or the like.
  19. Hwang, Soo-Yong, Heat radiation apparatus using modular cooling apparatus.
  20. Dany M. Zeidan ; Jeffrey Eisenmann ; David J. Maxham, Heat sink and electronic assembly including same.
  21. Sawyer, Michael; Kusz, Matthew J.; Gustine, Gary; Ham, Charles G.; Daniels, Fredrick A., Housings for circuit cards.
  22. Geschke,Gregory S.; Gustafson,William C.; Roberts,Alan B., Input/output transition board system.
  23. Gustine, Gary; Ham, Charles G.; Sawyer, Michael; Daniels, Fredrick A.; Bishop, Michelle; King, Lane; Kusz, Matthew J., Mechanical housing.
  24. Gustine, Gary; Ham, Charles G.; Sawyer, Michael; Daniels, Fredrick; Bishop, Michelle; King, Lane; Kusz, Matthew, Mechanical housing.
  25. Gustine,Gary; Ham,Charles G.; Sawyer,Michael; Daniels,Frederick; Bishop,Michelle; King,Lane; Kusz,Matthew, Mechanical housing.
  26. Barth, Michael K.; Ham, Charles G.; Tennis, Gene; Kusz, Matthew; Sjodin, Chad J.; Ferris, Matthew; Petersen, Cyle D., Methods and systems of heat transfer for electronic enclosures.
  27. Hunter Don J., Modular electronics packaging system.
  28. Lebo, Steve I., Modular electronics system chassis.
  29. Nicol, David H.; Joyce, Michael Dugan; Burgess, Brendan, Passive cooling and EMI shielding system.
  30. Nicol, David H.; Joyce, Michael Dugan; Burgess, Brendan, Passive cooling and EMI shielding system.
  31. Nicol, David H.; Joyce, Michael Dugan; Burgess, Brendan, Passive cooling and EMI shielding system.
  32. Kunz, Felix, Passively cooled computer.
  33. Inam Haroon ; Cronyn Doris ; Gebenini Edo P. ; Liang Zhixiang ; Pringle Bernie E. ; Rosebrough Gerald E. ; Zheng Raymond L., Power inverter with improved heat sink configuration.
  34. Lebo, Steve I.; Sellner, Scott J., Ruggedized electronic module cooling system.
  35. Schleif, Kurt Kramer; Shaw, Donald W.; Snider, Zachary John; Arceneaux, Mario Joseph, System and method for dissipating thermal energy away from electronic components in a rotatable shaft.
  36. Schultz, Ronald E.; Hall, Kenwood H.; Herbert, Patrick C.; Bodmann, Douglas R.; Killian, Daniel E., Thermal cooling of industrial electronic module by conductive structure.
  37. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient computer incorporating deploying CPU module.
  38. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient portable computer incorporating deploying CPU module.
  39. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient portable computer incorporating deploying CPU module.
  40. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient portable computer incorporating deploying CPU module.
  41. Sasov Yuriy Dmitrievich,RUX, Three-dimensional electronic module and a method of its fabrication and repair.
  42. Miller,Wayne H.; Mariano,Ricardo Alba; Holmes,Steven Thomas, Ultra compact computer arrangement.
  43. Miller,Wayne H.; Mariano,Ricardo Alba; Holmes,Steven Thomas, Ultra compact computer arrangement.
  44. Nair, Rajesh; Obinelo, Izundu F., Uniform heat dissipating and cooling heat sink.
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