초록 ▼

The present invention relates to an electroless gold plating solution, a method of plating by using the same, and an electronic device plated with gold by using the same. According to the present electroless gold plating solution, the plating solution components contain no cyanide ions, the amount o

The present invention relates to an electroless gold plating solution, a method of plating by using the same, and an electronic device plated with gold by using the same. According to the present electroless gold plating solution, the plating solution components contain no cyanide ions, the amount of a reducing agent used is small, and gold plating can be carried out without causing the gold plating on conducting paths having a fine interval between them to short-circuit the conducting paths. Therefore, according to the method of gold plating by using said electroless gold plating solution, a plating method that is safe in the plating work and in the treatment of its waste liquor can be accomplished. The method has a feature that the method can provide an electronic device on which parts can be mounted highly densely, and wherein the joint reliability to the parts is high.

대표청구항 ▼

An electronic device for mounting and interconnecting a plurality of integrated circuit semiconductor devices, comprising: a ceramic substrate having top and bottom surfaces, provided with a plurality of pads for connecting to said integrated circuit semiconductor devices, and with engineering chang

An electronic device for mounting and interconnecting a plurality of integrated circuit semiconductor devices, comprising: a ceramic substrate having top and bottom surfaces, provided with a plurality of pads for connecting to said integrated circuit semiconductor devices, and with engineering change pads, on the top surface, and provided with input/output pis on the bottom surface, said pads being in direct contact with the ceramic substrate and spaced from each other by a distance less than 200 m