초록 ▼

Diamond is deposited by chemical vapor deposition on two parallel substrates, by means of a plurality of filaments between said substrates. The substrates and filaments are in vertical configuration and the filaments are linear and spring-tensioned to compensate for thermal expansion and expansion c

Diamond is deposited by chemical vapor deposition on two parallel substrates, by means of a plurality of filaments between said substrates. The substrates and filaments are in vertical configuration and the filaments are linear and spring-tensioned to compensate for thermal expansion and expansion caused by filament carburization. The apparatus includes at least one and preferably two temperature controlling means, usually heat sinks, to maintain substrate temperature in the range of 900°-1000°C., for optimum rate of diamond deposition.

대표청구항 ▼

Apparatus for deposition of diamond on substrates by chemical vapor deposition, comprising: a closed reaction chamber having at least one gas inlet and at least one exhaust means, said chamber being capable of being maintained at a pressure below atmospheric; support means for supporting said substr

Apparatus for deposition of diamond on substrates by chemical vapor deposition, comprising: a closed reaction chamber having at least one gas inlet and at least one exhaust means, said chamber being capable of being maintained at a pressure below atmospheric; support means for supporting said substrates in said chamber parallel to each other and spaced apart to permit gas flow between said substrates; resistance heating means comprising a plurality of vertically extending linear, electrically conductive filaments situated substantially equidistant from said substrates, each of said filaments being secured at one end to a fixed electrode and at the other to a moveable electrode for supplying power to said filaments and thereby heating them; and a plurality of spring means attached to said moveable electrodes, for holding said filaments taut and substantially parallel to said substrates without causing breakage of said filaments.