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Conforming heat sink assembly 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0533957 (1990-05-29)
발명자 / 주소
  • Martin Jacob H. (Wellesley MA)
출원인 / 주소
  • The Charles Stark Draper Laboratories, Inc. (Cambridge MA 02)
인용정보 피인용 횟수 : 85  인용 특허 : 2

초록

A conforming heat sink assembly including a heat dispersive element is mounted in spaced relationship to a surface from which heat is to be conducted. A thermal interface is provided for coupling the heat dispersive element to the surface from which heat is to be conducted. The thermal interface inc

대표청구항

A heat sink assembly comprising: a heat dispersing member; an elastomeric member disposed between said heat dispersing member and an irregular surface to be cooled having protrusions, which physically contacts said heat dispersing member and said irregular surface; at least one of said heat dispersi

이 특허에 인용된 특허 (2)

  1. Rhoades John M. (Waynesboro VA) Montanino Patrick J. (Charlottesville VA), Arrangement for heat transfer between a heat source and a heat sink.
  2. Daszkowski Joseph M. (New Hyde Park NY), Thermal link.

이 특허를 인용한 특허 (85)

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  6. James C. Matayabas, Jr., Chain extension for thermal materials.
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  10. Kevin Kwong-Tai Chung, Compressible thermally-conductive interface.
  11. de Sorgo Miksa, Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer hav.
  12. Piepgras, Colin; Dowling, Kevin J., Configurations and methods for embedding electronics or light emitters in manufactured materials.
  13. Sen,Bidyut K.; Kirkman,Scott; Gektin,Vadim, Conformal heat spreader.
  14. Bunyan Michael H. ; de Sorgo Miksa, Conformal thermal interface material for electronic components.
  15. Bunyan, Michael H.; deSorgo, Miksa, Conformal thermal interface material for electronic components.
  16. Harper, Jr., Donald K.; Johnson, Lewis Robin, Connector housing for electrical connector.
  17. Harper, Jr., Donald K.; Johnson, Lewis Robin, Connector housing for electrical connector.
  18. Morgan,Frederick Marshall; Lys,Ihor, Diffuse illumination systems and methods.
  19. Hermeline, Nicolas; Flers, Alain; Barlerin, Stephane; Stricot, Yves, Dismountable optical coupling device.
  20. Bunyan, Michael H.; Blazdell, Phillip, Dispensable cured resin.
  21. Zerebilov, Arkady Y.; Ingram, Deborah A.; Lord, Hung-Wei; Buck, Jonathan E.; Stoner, Stuart C.; Ellison, Jason J., Electrical cable connector.
  22. Zerebilov, Arkady Y.; Ingram, Deborah A.; Lord, Hung-Wei; Buck, Jonathan E.; Stoner, Stuart C.; Ellison, Jason J., Electrical cable connector.
  23. Zerebilov, Arkady Y.; Ingram, Deborah A.; Lord, Hung-Wei; Buck, Jonathan E.; Stoner, Stuart C.; Ellison, Jason J., Electrical cable connector.
  24. Zerebilov, Arkady Y.; Lord, Hung-Wei; Buck, Jonathan E.; Stoner, Stuart C., Electrical cable connector.
  25. Ngo, Hung Viet, Electrical communication system having latching and strain relief features.
  26. Harper, Jr., Donald K.; Johnson, Lewis Robin, Electrical connector.
  27. Harper, Jr., Donald K.; Johnson, Lewis Robin, Electrical connector.
  28. Horchler, David C., Electrical connector.
  29. Ngo, Hung Viet, Electrical connector.
  30. Ngo, Hung Viet, Electrical connector having power contacts.
  31. Johnescu, Douglas M.; Buck, Jonathan E., Electrical connector having ribbed ground plate.
  32. Johnescu, Douglas M.; Buck, Jonathan E., Electrical connector having ribbed ground plate.
  33. Johnescu, Douglas M.; Buck, Jonathan E., Electrical connector having ribbed ground plate.
  34. Stoner, Stuart C.; Johnescu, Douglas M.; Buck, Jonathan E., Electrical connector having ribbed ground plate with engagement members.
  35. Horchler, David C., Electrical connector housing.
  36. Horchler, David C.; Johnson, Lewis Robin, Electrical connector with reduced stack height.
  37. Horchler, David C.; Johnson, Lewis Robin, Electrical connector with reduced stack height.
  38. Ngo, Hung Viet, Electrical connectors with air-circulation features.
  39. Buck, Jonathan E.; Stoner, Stuart C.; Minich, Steven E.; Johnescu, Douglas M.; Smith, Stephen B., Electrical ground shield.
  40. Swain,Wilfred James; Daily,Christopher G.; Kolivoski,Christopher J., Electrical power connectors with cooling features.
  41. Daily, Christopher G.; Swain, Wilfred J.; Stoner, Stuart C.; Kolivoski, Christopher J.; Johnescu, Douglas M., Electrical power contacts and connectors comprising same.
  42. Daily, Christopher G.; Swain, Wilfred J.; Stoner, Stuart C.; Kolivoski, Christopher J.; Johnescu, Douglas M., Electrical power contacts and connectors comprising same.
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  44. Daily, Christopher G.; Swain, Wilfred J.; Stoner, Stuart C.; Kolivoski, Christopher J.; Johnescu, Douglas M., Electrical power contacts and connectors comprising same.
  45. Matayabas, Jr., James C.; Koning, Paul; Wang, Jinlin, Electronic packages having good reliability comprising low modulus thermal interface materials.
  46. Tennessen, Peter Thomas; Weintraub, Jeffrey C.; Hermann, Weston Arthur, Extruded and ribbed thermal interface for use with a battery cooling system.
  47. Lys,Ihor; Mueller,George G., Geometric panel lighting apparatus and methods.
  48. Buck, Jonathan E.; Stoner, Stuart C.; Minich, Steven E.; Johnescu, Douglas M.; Smith, Stephen B., Ground shield for a right angle electrical connector.
  49. Kelley Lawrence R., Heat conductive interface material.
  50. Woo Suk Ha (Kyunggi-Do KRX), Heat dissipating apparatus for a semiconductor device for use in a motor drive.
  51. Buck, Jonathan E.; Stoner, Stuart C.; Minich, Steven E.; Johnescu, Douglas M.; Smith, Stephen B.; Zerebilov, Arkady Y.; Ingram, Deborah A.; Lord, Hung-Wei; Fulton, Robert Douglas, High speed electrical connector.
  52. Buck, Jonathan E.; Stoner, Stuart C.; Minich, Steven E.; Johnescu, Douglas M.; Smith, Stephen B.; Zerebilov, Arkady Y.; Ingram, Deborah A.; Lord, Hung-Wei; Fulton, Robert Douglas, High speed electrical connector.
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  54. Murphy James V., Integrated circuit intercoupling component with heat sink.
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  57. Mitchell,Jonathan E.; Bunyan,Michael H., Lightweight heat sink.
  58. DiBene, II, Joseph Ted; Hartke, David H., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
  59. Moreau Emmanuel,FRX ; Dessaux Christophe,FRX, Method for manufacturing a device for burning off thermal energy produced by electronic components embedded in a printed circuit card, and resulting device.
  60. Avery William J. ; Suy John S. ; Tichane David M., Method for mounting surface mount devices to a circuit board.
  61. DiBene, II,Joseph T.; Derian,Edward J., Micro-spring interconnect systems for low impedance high power applications.
  62. Matsuo Takahiro,JPX ; Maruyama Yoshio,JPX ; Hikita Osamu,JPX ; Kadoriku Shinji,JPX, Module for packaged IC.
  63. Mueller,George G.; Lys,Ihor A., Multicolored LED lighting method and apparatus.
  64. Mueller,George G.; Lys,Ihor A., Multicolored LED lighting method and apparatus.
  65. Mueller,George G.; Lys,Ihor A., Multicolored lighting method and apparatus.
  66. Stoner, Stuart C.; Kolivoski, Christopher J., Power cable connector system.
  67. Evans, Robert F.; Allison, Jeffrey W.; Rohrbaugh, Brian M., Power connector with safety feature.
  68. Ngo, Hung Viet; Houtz, Timothy W., Power connectors with contact-retention features.
  69. Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.
  70. Lundell, Timothy J.; Lundell, Thomas L., Sealed thermal interface component.
  71. Derian, Edward J.; DiBene, II, Joseph Ted; Hartke, David H., Separable power delivery connector.
  72. Moshtagh, Vahid S., Shape forming heat sink with flexible heat rod.
  73. Minich, Steven E, Surface-mount connector.
  74. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.
  75. Bergin, Jonathan M., Thermal interface material having a zone-coated release linear.
  76. Bunyan, Michael H., Thermal management materials.
  77. Bunyan, Michael H.; Young, Kent M., Thermal management materials having a phase change dispersion.
  78. Watchko, George R.; Gagnon, Matthew T.; Liu, Peter W.; de Sorgo, Miksa; Rodriguez, Christian V.; Lionetta, William G.; Oppenheim, Scott M., Thermal-sprayed metallic conformal coatings used as heat spreaders.
  79. Kumar, Sundaram Nand; Sites, Gary Garvin; Patel, Bhavik, Thermally conductive interface.
  80. Mueller,George G.; Lys,Ihor A.; Morgan,Frederick M.; Piepgras,Colin; Roberge,Brian; Kim,Hern; Dowling,Kevin J.; Logan,Derek; Cella,Charles H., Tile lighting methods and systems.
  81. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
  82. Buck, Jonathan E.; Stoner, Stuart C.; Minich, Steven E.; Johnescu, Douglas M.; Smith, Stephen B., Vertical electrical connector.
  83. Buck, Jonathan E.; Stoner, Stuart C.; Minich, Steven E.; Johnescu, Douglas M.; Smith, Stephen B., Vertical electrical connector.
  84. Buck, Jonathan E.; Stoner, Stuart C.; Minich, Steven E.; Johnescu, Douglas M.; Smith, Stephen B., Vertical electrical connector.
  85. Mueller, George G.; Lys, Ihor A.; Dowling, Kevin J.; Morgan, Frederick M.; Blackwell, Michael K.; Ducharme, Alfred D.; Osterhout, Ralph; Piepgras, Colin; Geary, Dawn; Holmes, Timothy, Wireless lighting control methods and apparatus.
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