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A substrate for mounting a flip-chip on a metallized circuit on the upper surface of the substrate. The substrate is silicon carbide condensed on a graphite or silicon core. The upper surface of the silicon carbide has a layer of insulating material comprised of silicon oxide, silicon nitride, alumi

A substrate for mounting a flip-chip on a metallized circuit on the upper surface of the substrate. The substrate is silicon carbide condensed on a graphite or silicon core. The upper surface of the silicon carbide has a layer of insulating material comprised of silicon oxide, silicon nitride, aluminum nitride, boron nitride, an organic insulator such as polyimide, and diamond. The insulator prevents inadvertent shorting of the integrated circuit. The insulating layer can be deposited on the silicon carbide by such processes as chemical vapor deposition, sputtering, spinning or roller coating.

대표청구항 ▼

A flip-chip substrate comprised of: a layer of silicon carbide; an insulating layer deposited on the upper surface of the silicon carbide layer, wherein the insulating layer is for supporting metallized circuitry to which a flip-chip can be attached, the insulating layer having a thickness substanti

A flip-chip substrate comprised of: a layer of silicon carbide; an insulating layer deposited on the upper surface of the silicon carbide layer, wherein the insulating layer is for supporting metallized circuitry to which a flip-chip can be attached, the insulating layer having a thickness substantially less than the thickness of the silicon carbide layer.