초록 ▼

A device to detect erosion of a target surface of sputtering sources in cathode sputtering layouts which has a target with at least one sensor at a predetermined position which is unchanged during the cathode sputtering process, directly detects the eroding of the target at a predetermined location.

A device to detect erosion of a target surface of sputtering sources in cathode sputtering layouts which has a target with at least one sensor at a predetermined position which is unchanged during the cathode sputtering process, directly detects the eroding of the target at a predetermined location. As a sensor measured quantity, photometric, electrical temperature, or pressure in the process chamber is used.

대표청구항 ▼

A method for detecting a predetermined depth of erosion within a target of a sputtering source for cathode sputtering process, comprising the steps of: monitoring a physical value, which physical value is steadily changing as a function of depth or erosion within said target using a sensor outputtin

A method for detecting a predetermined depth of erosion within a target of a sputtering source for cathode sputtering process, comprising the steps of: monitoring a physical value, which physical value is steadily changing as a function of depth or erosion within said target using a sensor outputting a signal representing the physical value monitored; providing at least one material discontinuity at a predetermined depth along the path of erosion through the target, such that said physical value significantly changes when the erosion reaches said discontinuity resulting in a discontinuity of said signal; and, detecting the occurrence of a discontinuity of the rate of change of said signal with respect to time, as an indication that erosion has reached said material discontinuity, said indication being substantially independent from steady dependency of said changing physical value with respect to erosion depth to said material discontinuity. A target arrangement for detecting a predetermined depth of erosion within a target of a sputtering source for cathode sputtering process, comprising: sensor means for monitoring a physical value, said physical value steadily changing as a function of depth or erosion of said target, said sensor means outputting a signal corresponding to said physical value monitored; a material interface providing a discontinuity of material, said discontinuity of material generating a discontinuity in said steadily changing physical value upon said erosion reaching said material discontinuity; and detection means connected to an output of said sensor means for detecting a discontinuity of the rate of change said output signal with respect to time corresponding to said discontinuity of said physical value upon said erosion reaching said material discontinuity, the occurrence of said discontinuity of said physical value being substantially independent from the steady change of said physical value as said erosion approaches said material interface.