초록 ▼

An apparatus for packaging semiconductor devices includes a die bonder, a wire bonder, and a molding unit wherein the die bonder, the wire bonder, and the molding unit are sequentially arranged for operation in an uninterrupted continuous sequence. To prevent semiconductor dies from being contaminat

An apparatus for packaging semiconductor devices includes a die bonder, a wire bonder, and a molding unit wherein the die bonder, the wire bonder, and the molding unit are sequentially arranged for operation in an uninterrupted continuous sequence. To prevent semiconductor dies from being contaminated by the dust generated by the molding unit, the die bonder and wire bonder are covered by an air cleaner chamber including an air filter and air ventilator. Alternatively, the molding unit is covered by an air draft chamber including an air supply nozzle and an exhaust pipe which exhausts the dust generated by the molding unit.

대표청구항 ▼

An apparatus for attaching leads to and encapsulating semiconductor dies comprising: a supporting bench; a die bonder for positioning and bonding semiconductor dies to respective predetermined locations on a respective one of a plurality of lead frames, each lead frame having a pattern of leads form

An apparatus for attaching leads to and encapsulating semiconductor dies comprising: a supporting bench; a die bonder for positioning and bonding semiconductor dies to respective predetermined locations on a respective one of a plurality of lead frames, each lead frame having a pattern of leads formed therein, said die bonder being disposed on and supported by said supporting bench; a wire bonder for connecting electrodes of a semiconductor die to said leads of the pattern of the respective lead frame with metallic wires, said wire bonder being disposed directly subsequent and adjacent to said die bonder and disposed on and supported by said supporting bench; molding means for molding and sealing each of said semiconductor dies with a predetermined portion of the respective lead frame into a resinous package, said molding means being disposed directly subsequent and adjacent to said wire bonder for performance of die bonding, wire bonding, and molding in an uninterrupted continuous sequence; and an air cleaner separating said die bonder and wire bonder from said molding means and supplying clean air to said die bonder and wire bonder but not to said molding means.