초록 ▼

An electric circuit assembly includes a copper pin (310) extending through aligned apertures (304, 314) in a directly bonded ceramic substrate (302) and copper lead frame (312), and directly bonded to the substrate (302). The pin (310) has an enlarged flange head (322) at one end, and is thermally d

An electric circuit assembly includes a copper pin (310) extending through aligned apertures (304, 314) in a directly bonded ceramic substrate (302) and copper lead frame (312), and directly bonded to the substrate (302). The pin (310) has an enlarged flange head (322) at one end, and is thermally deformed and enlarged at the other end (324) during the direct bonding. In another embodiment, one end (342) of a copper pin (340) extends out of an aperture (334) in a ceramic substrate (332) and slightly beyond the substrate surface (336). A lead frame (346) is directly bonded to the substrate surface (336) and droops around the protruding end (342) os the pin (340) and conforms thereto during the heating during the direct bonding. The lead frame (346) has a humped configuration over the aperture (334) in the substrate (332) and engages the protruding end (342) of the pin (340) and is deformed and raised thereby away from the substrate surface (336). In one form, the lead frame (346) is directly bonded to the substrate surface (336) around the entire perimeter of the protruding end (342) of the pin (340) and forms a hermetic seal with the substrate surface (336) peripherally surrounding the protruding pin end (342).

대표청구항 ▼

An electric circuit assembly comprising: an electrically insulating refractory substrate having an aperture extending therethrough between first and second surfaces; an electrically conductive terminal pin in said aperture directly bonded to said substrate by placing said pin in contact with said su

An electric circuit assembly comprising: an electrically insulating refractory substrate having an aperture extending therethrough between first and second surfaces; an electrically conductive terminal pin in said aperture directly bonded to said substrate by placing said pin in contact with said substrate, heating said pin and said substrate to a temperature below the melting point of said pin to form a eutectic with said pin which wets said pin and said substrate, and cooling said pin and said substrate, with said pin bonded to said substrate; an electrically conductive lead frame having an aperture extending therethrough between first and second surfaces, said lead frame being directly bonded to said substrate by placing said first surface of said lead frame in contact with said second surface of said substrate, heating said lead frame and said substrate to a temperature below the melting point of said lead frame to form a eutectic with said lead frame which wets said lead frame and said substrate, and cooling said lead frame and said substrate, with said lead frame bonded to said substrate, and with said aperture in said lead frame aligned with said aperture in said substrate, and with said pin in said apertures.