초록 ▼

A multiplex drop ejection construction for a drop-on-demand, ink jet printer. The construction includes a support substrate; a first circuit portion having branches that include a resistive heater element and a diode device formed in spaced relation on the substrate. A dielectric passivation layer o

A multiplex drop ejection construction for a drop-on-demand, ink jet printer. The construction includes a support substrate; a first circuit portion having branches that include a resistive heater element and a diode device formed in spaced relation on the substrate. A dielectric passivation layer overlies the first circuit portion except at the discrete terminal regions of the first circuit portion branches. A second circuit portion comprising a plurality of multiplex electrode lines overlies the passivation layer and includes connection sections extending through the passivation layer into contact with terminal regions of the first circuit. A second passivation layer overlies the second circuit portion, but not the resistive heater elements.

대표청구항 ▼

In a drop-on-demand ink jet printer of the kind having a plurality of orifices, a thin film drop ejection device including a corresponding plurality of drop ejection heater elements and manifold means of supplying ink to said heater elements, the improvement wherein said drop ejection device compris

In a drop-on-demand ink jet printer of the kind having a plurality of orifices, a thin film drop ejection device including a corresponding plurality of drop ejection heater elements and manifold means of supplying ink to said heater elements, the improvement wherein said drop ejection device comprises: (a) a support substrate; (b) a first circuit portion comprising a plurality of circuit branches that each include a resistive heater element and a diode device formed in spaced relation on said substrate and coupled in series by first circuit branch electrode lines to terminal regions; (c) a dielectric passivation layer overlying said first circuit portion except at the discrete terminal regions of said first circuit portion branches; (d) a second circuit portion comprising a plurality of multiplex electrode lines overlying said dielectric passivation layer including connection sections extending through said dielective passivation layer into contact with terminal regions of said first circuit portion; and (e) a second passivation layer overlying said second circuit portion, but not overlying said resistive heater elements.