초록 ▼

A reagent chemical is directed along a first pipe portion (20) that extends along one side of the array of wafers (14) and which contains a plurality of jets (33) for projecting the chemical toward the wafers. A plurality of second pipe portions (21) transmits an inert gas, with each pipe portion ha

A reagent chemical is directed along a first pipe portion (20) that extends along one side of the array of wafers (14) and which contains a plurality of jets (33) for projecting the chemical toward the wafers. A plurality of second pipe portions (21) transmits an inert gas, with each pipe portion having a plurality of jets (34) for projecting the gas toward the floor of the tank.

대표청구항 ▼

A method for cleaning semiconductor wafers comprising: locating at the bottom of an acid tank a first pipe portion and a plurality of second pipe portions; the first and second pipe portions being integrated into a single pipe unit made of teflon and each pipe portion containing an array of axially

A method for cleaning semiconductor wafers comprising: locating at the bottom of an acid tank a first pipe portion and a plurality of second pipe portions; the first and second pipe portions being integrated into a single pipe unit made of teflon and each pipe portion containing an array of axially spaced openings; locating on the pipe unit an array of wafers to be cleaned; immersing the array of wafers and the pipe unit in an acid selected from the group consisting of sulfuric acid and phosphoric acid; agitating the acid by directing a non-reactant gas through the plurality of second pipe portions such that the gas is projected through the axially spaced openings of the second pipe portions into the acid to form bubbles in the acid; directing a cleaning reagent comprising a hydrogen peroxide solution against the wafer array comprising the step of directing the hydrogen peroxide solution into the first pipe portions such that it is projected through the axially spaced openings of the first pipe portion toward the wafer array.