초록

A method for fabricating multilayer circuits comprising patterned conductive layers separated by dielectric layers and connected by vias in the dielectric, wherein the unfired dielectric layers are laminated as tapes or sheets over either a fired or unfired conductor layer while under a vacuum.

대표청구항 ▼

A method for the fabrication of multilayer circuits comprising the sequential steps of: (a) applying to an electrically non-conducting layer a patterned conductive layer in registry with the vias, if any, formed in the non-conducting layer; (b) laminating to the conductive layer and exposed areas of

A method for the fabrication of multilayer circuits comprising the sequential steps of: (a) applying to an electrically non-conducting layer a patterned conductive layer in registry with the vias, if any, formed in the non-conducting layer; (b) laminating to the conductive layer and exposed areas of the non-conducting layer a dielectric layer while under vacuum, at least one of the electrically non-conducting layer(s) and dielectric layer(s) being an unfired dielectric tape optionally having a via pattern formed therein which is in registry with the patterned conductive layer; (c) if the unfired dielectric tape of step (b) lacks a via pattern, forming vias in selected positions through the layer of unfired dielectric tape in registration with the patterned conductive layer; (d) firing the assemblage of step (c); (e) filling the vias in the dielectric tape with a conductive metallization; (f) firing the assemblage of step (e); (g) applying a patterned conductive layer to the dielectric tape in registry with the vias therein; and (h) firing the assemblage of step (g).