초록 ▼

An instrument (1) for controlling the temperature of electronic components (20) under test creates a testing environment in an enclosure within which a component contacts directly the active face of a set of back-to-back Peltier cells (50). Heating and cooling of the component (20) under test is rea

An instrument (1) for controlling the temperature of electronic components (20) under test creates a testing environment in an enclosure within which a component contacts directly the active face of a set of back-to-back Peltier cells (50). Heating and cooling of the component (20) under test is readily achieved by controlling the Peltier cells (50) and test components may be easily interchanged using a removable mounting assembly (10, 11, 12, 13). The instrument has the advantages of being small, portable, easy to operate, inexpensive to manufacture and to run, and of producing very little electrical noise.

대표청구항 ▼

A temperature control instrument for an electronic component under test comprising: a body; a testing enclosure in said body for the component; a socket means mounted within said testing enclosure for the reception of the component; a thermoelectric device for heating or cooling said enclosure, said

A temperature control instrument for an electronic component under test comprising: a body; a testing enclosure in said body for the component; a socket means mounted within said testing enclosure for the reception of the component; a thermoelectric device for heating or cooling said enclosure, said thermoelectric device having a heat transfer active face and and a reference face, said reference face being maintained at a substantially constant temperature, and a controller comprising a control circuit for controlling operation of the thermoelectric device by varying the magnitude and direction of current applied to the thermoelectric device to alter the temperature of said active face; a mounting assembly for mounting said socket means and thermoelectric device separately and relatively movable with respect to each other between a closed position in which said active face is in contact with the electronic component and an open position in which said active face and component are spaced apart; and temperature sensing means operatively connected to said controller for sensing temperature within the enclosure.