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Package for an opto-electronic component 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G02B-006/36
출원번호 US-0263188 (1988-10-28)
발명자 / 주소
  • Johnson Melvin H. (Chadds Ford PA) Krauss Leland L. (Aston PA) Landman Dirk (Lancaster PA)
출원인 / 주소
  • E. I. du Pont de Nemours and Company (Wilmington DE 02)
인용정보 피인용 횟수 : 26  인용 특허 : 12

초록

A package for an opto-electronic component and associated pigtail is characterized by a notch formed in the sidewall of an open topped lower housing portion which interrupts the edge of the housing such that the component can be laid into the housing with the pigtail extending through the notch.

대표청구항

A package for an opto-electric component comprising: a base; a sidewall on the base, the sidewall having an upper edge theron, the edge being interrupted by a notch formed in the sidewall, an open cradle member mounted to the sidewall in proximity to and in communication with the notch therein; a co

이 특허에 인용된 특허 (12)

  1. Estrada Calixto (Wilmington DE) Hamerslag James D. (West Chester PA) Hooley Robert W. (Wilmington DE) Hunt John W. (Wilmington DE) Johnson Melvin H. (Chadds Ford PA) McCabe Duncan D. (Wilmington DE) , Decoupled fiber optic feedthrough assembly.
  2. Dodson Ronald K. (Beaverton OR) Enochs Raymond S. (Hillsboro OR) Randall Randy S. (Beaverton OR), Electro-optical transducer module.
  3. Kovats Tibor F. I. (Ottawa CAX) Devenyi Tibor F. (Nepean CAX) Look Christopher M. (Nepean CAX), Light emitting device package having combined heater/cooler.
  4. Stevenson David W. (Mesa AZ), Low cost electro-optical connector.
  5. Krause Dieter (Munich DEX), Method for connecting elements of optical communication technology to one another or to elements of releasable plug conn.
  6. Clark David W. (Lititz PA) Freedman Morton (Lancaster PA), Optical fiber assembly and optically coupled device package including same.
  7. Gordon Eugene I. (Convent Station NJ) Nielsen Robert J. (Upper Black Eddy PA) Stafford John W. (Summit NJ), Optoelectronics package for a semiconductor laser.
  8. Camlibel ; Irfan ; Rich ; Theodore Charles, Package for optical devices including optical fiber-to-metal hermetic seal.
  9. Yokozawa Masami (Kyoto JPX) Kanai Isao (Shiga JPX), Plastic encapsulated semiconductor device and method for manufacturing the same.
  10. Prussas Herbert (Reichertshausen DEX), Protective tube arrangement for a glass fiber.
  11. Henry Raymond (Paris FRX) Resneau Jean-Claude (Paris FRX) Bouvet Jean-Victor (Paris FRX), Sealed enclosing system for coupling an optoelectronic device and an optical fibre.
  12. Taumberger Franz (Munich DEX), Transmitting and receiving device for optoelectronic communication systems, and method of making the device.

이 특허를 인용한 특허 (26)

  1. Newton Mark D. ; Pratt Steven D. ; Muthuswamy Sivakumar ; Williams Kimberly A. ; Swirbel Thomas J. ; Davis James Lynn ; Martin Lara J. ; Mulligan Robert J. ; Pieper Kevin J. ; Lee Brian H.,IEX ; Call, Communication device having a reduced level of hazardous substances.
  2. Conner, Mark Edward, Composite cable breakout assembly.
  3. Verdiell Jean-Marc, Dual-enclosure optoelectronic packages.
  4. Yamada, Shoji, Electronic connector terminal.
  5. Yamada,Shoji, Electronic connector terminal, a method for plating, and a terminal stack.
  6. Beamon, Hubert Blair; Cox, Terry Dean, Fiber optic enclosures employing clamping assemblies for strain relief of cables, and related assemblies and methods.
  7. Finot, Marc A.; Lake, Rickie C., Hermetic sealing of optical module.
  8. Hans-Ludwig Althaus DE; Franz Auracher DE, Housing configuration for a laser module.
  9. Johnson Dean A., Image sensor assembly.
  10. Johnson Dean A., Image sensor assembly and packaging method.
  11. Makrides-Saravanos, Elli; Strause, Craig Alan; Strause, Kevin Lee, Impact resistant fiber optic enclosures and related methods.
  12. Williamson, III, Robert S.; Marsland, Robert A., Method & apparatus for packaging high frequency components.
  13. Williamson III Robert S. ; Marsland Robert, Method and apparatus for optically aligning optical fibers with optical devices.
  14. Tower Steven A. ; Mravic Brian, Method for making a ceramic to metal hermetic seal.
  15. Bolton, Albert Martin; Strause, Kevin Lee, Multi-port optical connection terminal.
  16. Kathman, Alan D; Morris, James E; Hammond, John Barnett; Feldman, Michael R., Optical apparatus.
  17. Tower Steven A. ; Mravic Brian, Optical component package with a hermetic seal.
  18. Ido, Tatemi; Yoshida, Kouji, Optical module and optical communication system.
  19. Kasahara Masataka,JPX ; Sakaguchi Kenichi,JPX, Optical semiconductor device and lead frame used in such a device.
  20. Velsher, Benne; Boehm, John F., Opto-electronic package for integrated sealing of optical fibers.
  21. Stricot, Yves; Belhora, Abdelkrim, Optoelectronic emitter-receiver device.
  22. Sakata Masato,JPX ; Kazama Yukio,JPX ; Ono Kazuto,JPX ; Murata Hideaki,JPX, Package for optical semiconductor element and method for manufacturing the same.
  23. Bendelli, Giampaolo; Di Mascio, Enrico; Puleo, Mario; Scofet, Marco, Package for opto-electrical components.
  24. Carralero, Michael A.; Chan, Eric Y.; Koshinz, Dennis G., Ruggedized photonic crystal sensor packaging.
  25. Kathman, Alan D; Morris, James E; Hammond, John Barnett; Feldman, Michael R., Wafer based optical chassis and associated methods.
  26. Kathman,Alan D; Morris,James E; Hammond,John Barnett; Feldman,Michael R., Wafer based optical chassis and associated methods.
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